參數(shù)資料
型號(hào): MPC8250ACZQIHBC
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 51/62頁(yè)
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 516-PBGA
標(biāo)準(zhǔn)包裝: 40
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 200MHz
電壓: 1.8V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA
供應(yīng)商設(shè)備封裝: 516-FPBGA(27x27)
包裝: 托盤
MPC8250 Hardware Specifications, Rev. 2
Freescale Semiconductor
55
Package Description
5
Package Description
The following sections provide the package parameters and mechanical dimensions.
CLKIN2
K21
SPARE4 2
C14
PCI_MODE 3
AD24
B15
THERMAL0 4
E17
THERMAL14
C23
I/O power
E6, F6, H6, L5, L6, P6, T6, U6, V5,
Y5, AA6, AA8, AA10, AA11, AA14,
AA16, AA17, AB19, AB20, W21,
U21, T21, P21, N21, M22, J22,
H21, F21, F19, F17, E16, F14,
E13, E12, F10, E10, E9
Core Power
L3, V4, W3, AC11, AD11, AB15,
U25, T24, J24, H25, F23, B19,
D17, C17, D10, C10
Ground
A2, B1, B2, A5, C5, C18, D4, D6,
G2, L4, P1, R1, R4, AC4, AE7,
AC23, Y25, N24, J23, A23, D23,
D20, E18, A13, A16, K10, K11,
K12, K13, K14, K15, K16, K17,
L10, L11, L12, L13, L14, L15, L16,
L17, M10, M11, M12, M13, M14,
M15, M16, M17, N10, N11, N12,
N13, N14, N15, N16, N17, P10,
P11, P12, P13, P14, P15, P16,
P17, R10, R11,R12, R13, R14,
R15, R16, R17, T10, T11, T12,
T13, T14, T15, T16, T17, U10,
U11, U12, U13, U14, U15, U16,
U17
1
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
2
Must be pulled down or left floating.
3
If PCI is not desired, must be pulled up or left floating.
4
For information on how to use this pin, refer to
MPC8260 PowerQUICC II Thermal Resistor Guide (AN2271/D).
Table 22. MPC8250 PBGA Package Pinout List (continued)
Pin Name
Ball
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