參數(shù)資料
型號: MPC8245TZU333D
廠商: Freescale Semiconductor
文件頁數(shù): 47/68頁
文件大小: 0K
描述: IC MPU 32BIT 333MHZ 352-TBGA
標(biāo)準(zhǔn)包裝: 24
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 333MHz
電壓: 2V
安裝類型: 表面貼裝
封裝/外殼: 352-LBGA
供應(yīng)商設(shè)備封裝: 352-TBGA(35x35)
包裝: 托盤
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
51
System Design
Figure 28. Die Junction-to-Ambient Resistance
The board designer can choose between several types of heat sinks to place on the MPC8245. Several
commercially-available heat sinks for the MPC8245 are provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
2
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18
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1.5
22.5
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Airflow Velocity (m/s)
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
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