參數資料
型號: MPC8241LZQ266D
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
封裝: 25 X 25 MM, 1.27 MM HEIGHT, PLASTIC, BGA-357
文件頁數: 48/64頁
文件大?。?/td> 827K
代理商: MPC8241LZQ266D
52
MPC8241 Integrated Processor Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
Figure 31. Die Junction-to-Ambient Resistance
The board designer can choose among several types of heat sinks to place on the MPC8241. Several
commercially available heat sinks for the MPC8241 are provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Other
heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering
offer different heat sink-to-ambient thermal resistances, and may or may not need airflow.
0.0
10.0
20.0
30.0
40.0
50.0
00.5
11.5
22.5
Airflow V elocity (m/s)
D
ie
Juncti
on-to-A
mbi
e
n
t
Thermal
Resistance
(C/W
)
1s
2s 2p
1s /sink
2s 2p/s ink
相關PDF資料
PDF描述
MPC8241LZP266B 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
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MPC8241LVR200B 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357
MPC8245ARZU400D 32-BIT, 400 MHz, RISC PROCESSOR, PBGA352
相關代理商/技術參數
參數描述
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