參數(shù)資料
型號： MPC755CRX400LE
廠商： Motorola, Inc.
英文描述： RISC Microprocessor Hardware Specifications
中文描述： RISC微處理器硬件規(guī)格
文件頁數(shù)： 11/56頁
文件大?。?/td> 1652K
代理商： MPC755CRX400LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
11
Electrical and Thermal Characteristics
Table 6
provides the DC electrical characteristics for the MPC755.
Table 5. Thermal Sensor Specifications
At recommended operating conditions (see
Table 3
)
Characteristic
Min
Max
Unit
Notes
Temperature range
0
127
°C
1
Comparator settling time
20
—
μs
2, 3
Resolution
4
—
°C
3
Accuracy
–12
+12
°C
3
Notes:
1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an absolute temperature, but
must be interpreted by software to derive the absolute junction temperature. For information about the use and calibration of the TAU, see
Freescale Application Note AN1800/D,
Programming the Thermal Assist Unit in the MPC750 Microprocessor.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR.
3. Guaranteed by design and characterization.
Table 6. DC Electrical Specifications
At recommended operating conditions (see
Table 3
)
Characteristic
Nominal
Bus Voltage
1
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except SYSCLK)
2.5
V
IH
1.6
(L2)OV
DD
+ 0.3
V
2, 3
3.3
V
IH
2.0
(L2)OV
DD
+ 0.3
V
2, 3
Input low voltage (all inputs except SYSCLK)
2.5
V
IL
–0.3
0.6
V
2
3.3
V
IL
–0.3
0.8
V
SYSCLK input high voltage
2.5
KV
IH
1.8
OV
DD
+ 0.3
V
3.3
KV
IH
2.4
OV
DD
+ 0.3
V
SYSCLK input low voltage
2.5
KV
IL
–0.3
0.4
V
3.3
KV
IL
–0.3
0.4
V
Input leakage current,
V
in
= L2OV
DD
/OV
DD
I
in
—
10
μA
2, 3
High-Z (off-state) leakage current,
V
in
= L2OV
DD
/OV
DD
I
TSI
—
10
μA
2, 3, 5
Output high voltage, I
OH
=
–6
mA
2.5
V
OH
1.7
—
V
3.3
V
OH
2.4
—
V
Output low voltage, I
OL
=
6
mA
2.5
V
OL
—
0.45
V
3.3
V
OL
—
0.4
V
相關PDF資料
PDF描述
MPC755 RISC Microprocessor Hardware Specifications
MPC755BRX300LE RISC Microprocessor Hardware Specifications
MPC755BPX300LE RISC Microprocessor Hardware Specifications
MPC8240EC Integrated Processor Hardware Specifications
MPC8240 32-Bit Microprocessor(32位微處理器)
相關代理商/技術參數(shù)
參數(shù)描述
MPC755CRX400TE 功能描述:微處理器 - MPU GF RV2.84A-40C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CVT350LE 功能描述:微處理器 - MPU GF RV2.8,4A,105C,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CVT400LE 功能描述:微處理器 - MPU GF RV2.84A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC76 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors
MPC76-0.05HK 制造商:FUKUSHIMA 功能描述:
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*