參數(shù)資料
型號： MPC755CPX400LE
廠商： Motorola, Inc.
英文描述： RISC Microprocessor Hardware Specifications
中文描述： RISC微處理器硬件規(guī)格
文件頁數(shù)： 12/56頁
文件大?。?/td> 1652K
代理商： MPC755CPX400LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
12
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 7
provides the power consumption for the MPC755.
Capacitance, V
in
= 0 V, f = 1 MHz
C
in
—
5.0
pF
3, 4
Notes:
1. Nominal voltages; see
Table 3
for recommended operating conditions.
2. For processor bus signals, the reference is OV
DD
while L2OV
DD
is the reference for the L2 bus signals.
3. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK) and IEEE 1149.1 boundary scan (JTAG) signals.
4. Capacitance is periodically sampled rather than 100% tested.
5. The leakage is measured for nominal OV
DD
and V
DD
, or both OV
DD
and V
DD
must vary in the same direction (for example, both OV
DD
and
V
DD
vary by either +5% or –5%).
Table 7. Power Consumption for MPC755
Processor (CPU) Frequency
Unit
Notes
300 MHz
350 MHz
400 MHz
Full-Power Mode
Typical
3.1
3.6
5.4
W
1, 3, 4
Maximum
4.5
5.3
8.0
W
1, 2
Doze Mode
Maximum
1.8
2.0
2.3
W
1, 2, 4
Nap Mode
Maximum
1.0
1.0
1.0
W
1, 2, 4
Sleep Mode
Maximum
550
550
550
mW
1, 2, 4
Sleep Mode (PLL and DLL Disabled)
Maximum
510
510
510
mW
1, 2
Notes:
1. These values apply for all valid processor bus and L2 bus ratios. The values do not include I/O supply power (OV
DD
and L2OV
DD
) or PLL/DLL
supply power (AV
DD
and L2AV
DD
). OV
DD
and L2OV
DD
power is system dependent, but is typically <10% of V
DD
power. Worst case power
consumption for AV
DD
= 15 mW and L2AV
DD
= 15 mW.
2. Maximum power is measured at nominal V
DD
(see
Table 3
) while running an entirely cache-resident, contrived sequence of instructions
which keep the execution units maximally busy.
3. Typical power is an average value measured at the nominal recommended V
DD
(see
Table 3
) and 65
°
C in a system while running a typical
code sequence.
4. Not 100% tested. Characterized and periodically sampled.
Table 6. DC Electrical Specifications (continued)
At recommended operating conditions (see
Table 3
)
Characteristic
Nominal
Bus Voltage
1
Symbol
Min
Max
Unit
Notes
相關PDF資料
PDF描述
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相關代理商/技術參數(shù)
參數(shù)描述
MPC755CPX400LE 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360
MPC755CPX400LER2 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CRX350LE 功能描述:微處理器 - MPU 360CBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CRX350TE 功能描述:微處理器 - MPU 360CBGA,RV2.8, RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CRX400LE 功能描述:微處理器 - MPU GF RV2.84A105C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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