參數(shù)資料
型號： MPC755BRX300LE
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： RISC Microprocessor Hardware Specifications
中文描述： 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, CERAMIC, BGA-360
文件頁數(shù)： 10/56頁
文件大?。?/td> 1652K
代理商： MPC755BRX300LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
10
Freescale Semiconductor
Electrical and Thermal Characteristics
The MPC755 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-analog
converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the
MPC750 RISC
Microprocessor Family User’s Manual
for more information on the use of this feature. Specifications for the thermal
sensor portion of the TAU are found in
Table 5
.
Table 4. Package Thermal Characteristics
6
Characteristic
Symbol
Value
Unit
Notes
MPC755
CBGA
MPC755
PBGA
MPC745
PBGA
Junction-to-ambient thermal resistance, natural
convection
R
θ
JA
24
31
34
°C/W
1, 2
Junction-to-ambient thermal resistance, natural
convection, four-layer (2s2p) board
R
θ
JMA
17
25
26
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min
airflow, single-layer (1s) board
R
θ
JMA
18
25
27
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min
airflow, four-layer (2s2p) board
R
θ
JMA
14
21
22
°C/W
1, 3
Junction-to-board thermal resistance
R
θ
JB
8
17
17
°C/W
4
Junction-to-case thermal resistance
R
θ
JC
<0.1
<0.1
<0.1
°C/W
5
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with
the calculated case temperature. The actual value of R
θ
JC
for the part is less than 0.1°C/W.
6. Refer to
Section 8.8, “Thermal Management Information
,” for more details about thermal management.
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