參數(shù)資料
型號： MPC5603PEFMLQ7
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-144
文件頁數(shù)： 21/72頁
文件大?。?/td> 1382K
代理商： MPC5603PEFMLQ7
MPC5604P Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
28
4RθJMA
Thermal resistance junction-to-ambient2
@ 200 ft./min.3, four layer
board—2s2p
37
°C/W
5RθJB
Thermal resistance junction to board4
—31
°C/W
6RθJCtop Thermal resistance junction to case (top)
5
—12
°C/W
7
Ψ
JT
Junction to package top natural convection6
—2
°C/W
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
3 Flow rate of forced air flow.
4 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
5 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
6 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
Table 9. Thermal Characteristics for 100-pin LQFP1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
No.
Symbol
Parameter
Conditions
Typical
Value
Unit
1RθJA
Thermal resistance junction-to-ambient
natural convection2
2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Single layer board—1s
52
°C/W
2RθJA
Thermal resistance junction-to-ambient
natural convection2
Four layer board—2s2p
39
°C/W
3RθJMA
Thermal resistance junction-to-ambient2
@ 200 ft./min.3, single layer
board—1s
3 Flow rate of forced air flow.
42
°C/W
4RθJMA
Thermal resistance junction-to-ambient2
@ 200 ft./min.3, four layer
board—2s2p
33
°C/W
5RθJB
Thermal resistance junction to board4
4 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
—24
°C/W
6RθJCtop Thermal resistance junction to case (Top)
5
5 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
—12
°C/W
7
Ψ
JT
Junction to package top natural convection6
6 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
—3
°C/W
Table 8. Thermal Characteristics for 144-pin LQFP1 (continued)
No.
Symbol
Parameter
Conditions
Typical
Value
Unit
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