參數(shù)資料
型號: MPC5554AZP132
廠商: Freescale Semiconductor
文件頁數(shù): 55/58頁
文件大?。?/td> 0K
描述: IC MPU 2M FLASH 132MHZ 416-PBGA
標(biāo)準(zhǔn)包裝: 40
系列: MPC55xx Qorivva
核心處理器: e200z6
芯體尺寸: 32-位
速度: 132MHz
連通性: CAN,EBI/EMI,SCI,SPI
外圍設(shè)備: DMA,POR,PWM,WDT
輸入/輸出數(shù): 256
程序存儲器容量: 2MB(2M x 8)
程序存儲器類型: 閃存
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 1.35 V ~ 1.65 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 40x12b
振蕩器型: 外部
工作溫度: -55°C ~ 125°C
封裝/外殼: 416-BBGA
包裝: 托盤
配用: MPC5554INT-ND - BOARD DEMO MPC5554
MPC5554EVBISYS-ND - BOARD EVAL ISYSTEMS MPC5554
MPC5554EVBGHS-ND - BOARD EVAL GREEN HILLS SOFTWARE
MPC5554EVB-ND - BOARD EVALUATION MPC5554
MPC5534EVBISYS-ND - KIT EVAL ISYSTEMS MPC5534
MPC5534EVBGHS-ND - KIT EVAL GREEN HILLS SOFTWARE
MPC5534EVB-ND - KIT EVALUATION MPC5534MZP80
MPC5554EVBE-ND - BOARD EVAL FOR MPC5554
MPC5534EVBE-ND - BOARD EVAL FOR MPC5534
MPC5554 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
6
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
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MPC5554EVB 功能描述:開發(fā)板和工具包 - 其他處理器 MPC5554 CUSTOMER Qorivva RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC5554EVBE 功能描述:開發(fā)板和工具包 - 其他處理器 MPC5554 CUSTOMER Qorivva RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC5554EVBE 制造商:Freescale Semiconductor 功能描述:MPC5554 CUSTOMER DEMO BD
MPC5554EVBGHS 功能描述:開發(fā)軟件 GREEN HILLS SW Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors
MPC5554EVBISYS 功能描述:開發(fā)軟件 ISYSTEMS CONTENT Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors