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參數(shù)資料
| 型號： | MPC5554AZP132 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 45/58頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU 2M FLASH 132MHZ 416-PBGA |
| 標準包裝： | 40 |
| 系列： | MPC55xx Qorivva |
| 核心處理器： | e200z6 |
| 芯體尺寸： | 32-位 |
| 速度： | 132MHz |
| 連通性： | CAN，EBI/EMI，SCI，SPI |
| 外圍設(shè)備： | DMA，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 256 |
| 程序存儲器容量： | 2MB（2M x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 64K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.35 V ~ 1.65 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 40x12b |
| 振蕩器型： | 外部 |
| 工作溫度： | -55°C ~ 125°C |
| 封裝/外殼： | 416-BBGA |
| 包裝： | 托盤 |
| 配用： | MPC5554INT-ND - BOARD DEMO MPC5554 MPC5554EVBISYS-ND - BOARD EVAL ISYSTEMS MPC5554 MPC5554EVBGHS-ND - BOARD EVAL GREEN HILLS SOFTWARE MPC5554EVB-ND - BOARD EVALUATION MPC5554 MPC5534EVBISYS-ND - KIT EVAL ISYSTEMS MPC5534 MPC5534EVBGHS-ND - KIT EVAL GREEN HILLS SOFTWARE MPC5534EVB-ND - KIT EVALUATION MPC5534MZP80 MPC5554EVBE-ND - BOARD EVAL FOR MPC5554 MPC5534EVBE-ND - BOARD EVAL FOR MPC5534 |
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Electrical Characteristics
MPC5554 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
5
3.2
Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
28
Maximum solder temperature 11
Lead free (Pb-free)
Leaded (SnPb)
TSDR
—
260.0
245.0
oC
29
Moisture sensitivity level 12
MSL
—
3
1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
2 1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150 oC.
3 All functional non-supply I/O pins are clamped to V
SS and VDDE, or VDDEH.
4 AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
5 Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on eTPUB[15] and SINB during the internal power-on reset (POR) state.
6 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDEH supplies, if the
maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage specifications.
7 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDE supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage specifications.
8 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
9 Total injection current for all analog input pins must not exceed 15 mA.
10 Lifetime operation at these specification limits is not guaranteed.
11 Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
12 Moisture sensitivity per JEDEC test method A112.
Table 3. MPC5554 Thermal Characteristics
Spec
MPC5554 Thermal Characteristic
Symbol
416 PBGA
Unit
1
Junction to ambient 1, 2, natural convection (one-layer board)
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
RJA
24
°C/W
2
Junction to ambient 1, 3, natural convection (four-layer board 2s2p)
3 Per JEDEC JESD51-6 with the board horizontal.
RJA
18
°C/W
3
Junction to ambient 1, 3 (@200 ft./min., one-layer board)
RJMA
19
°C/W
4
Junction to ambient 1, 3 (@200 ft./min., four-layer board 2s2p)
RJMA
15
°C/W
5
Junction to board 4 (four-layer board 2s2p)
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RJB
9
°C/W
6
Junction to case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RJC
5°C/W
7
Junction to package top 6, natural convection
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
JT
2°C/W
Table 2. Absolute Maximum Ratings 1 (continued)
Spec
Characteristic
Symbol
Min.
Max.
Unit
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| MPC5554EVB | 功能描述:開發(fā)板和工具包 - 其他處理器 MPC5554 CUSTOMER Qorivva RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC5554EVBE | 功能描述:開發(fā)板和工具包 - 其他處理器 MPC5554 CUSTOMER Qorivva RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC5554EVBE | 制造商:Freescale Semiconductor 功能描述:MPC5554 CUSTOMER DEMO BD |
| MPC5554EVBGHS | 功能描述:開發(fā)軟件 GREEN HILLS SW Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5554EVBISYS | 功能描述:開發(fā)軟件 ISYSTEMS CONTENT Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
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