參數(shù)資料
型號(hào)： MPC5534EVBE
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 56/60頁(yè)
文件大小： 0K
描述： BOARD EVAL FOR MPC5534
產(chǎn)品培訓(xùn)模塊： MPC55xx PitchPak Family
標(biāo)準(zhǔn)包裝： 1
類型： MCU
適用于相關(guān)產(chǎn)品： MPC5534
所含物品： 評(píng)估板和演示軟件
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MPC5534 Microcontroller Data Sheet, Rev. 6
Electrical Characteristics
Freescale Semiconductor
6
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
6 The thermal characterization parameter indicates the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC5534EVBE 制造商:Freescale Semiconductor 功能描述:MPC55xx Evaluation Board
MPC5534EVBGHS 功能描述:開發(fā)軟件 GREEN HILLS SW CONTENT M RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors
MPC5534EVBISYS 功能描述:開發(fā)軟件 ISYSTEMS CONTENT MPC5534 RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors
MPC5534MVF40 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5534MVF40R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
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