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參數(shù)資料
| 型號： | MPC2106CDG66 |
| 廠商： | MOTOROLA INC |
| 元件分類： | SRAM |
| 英文描述： | 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
| 中文描述： | 128K X 72 CACHE SRAM MODULE, 9 ns, PDMA178 |
| 文件頁數(shù)： | 15/20頁 |
| 文件大?。?/td> | 245K |
| 代理商： | MPC2106CDG66 |
MPC2105A
MPC2106A
MPC2105B
MPC2106B
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC2106SG66 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
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| MPC222225T | 制造商:AMEC THERMASOL 功能描述:HEAT SINK CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK, CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK; Thermal Resistance:10.21C/W; External Height - Imperial:0.098"; External Height - Metric:2.5mm; External Width - Imperial:0.866"; External Width - Metric:22mm; External Length - Imperial:0.866"; Heat Sink Material:Ceramic;RoHS Compliant: Yes |
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