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6
MPC106 PCI Bridge/Memory Controller Hardware Specifications
Electrical and Thermal Characteristics
Table 3 provides the package thermal characteristics for the 106.
Table 4 provides the DC electrical characteristics for the 106, assuming Vdd = AVdd = 3.3 ± 5% V DC,
GND = 0 V DC, and 0
≤
T
j
≤
105 °C.
Table 5 lists the power consumption of the 106.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Notes
Supply voltage
Vdd
3.3 ± 165 mv
V
—
PLL supply voltage
AVdd
3.3 ± 165 mv
V
—
Input voltage
Vin
Tj
0 to 5.5
V
—
Die junction temperature
0 to 105
°C
The extended temperature parts have die junction
temperature of -40 to 105°C
Table 3. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
CBGA package thermal resistance, junction-to-top of die
θ
JC
0.133
°C/W
Note
: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
Table 4. DC Electrical Specifications
Characteristic
Symbol
Min
Max
Unit
Input high voltage (all inputs except SYSCLK)
V
IH
2
5.5
V
Input low voltage (all inputs except SYSCLK)
V
IL
GND
0.8
V
SYSCLK input high voltage
CV
IH
2.4
5.5
V
SYSCLK input low voltage
CV
IL
GND
0.4
V
Input leakage current, V
in
=3.3 V
1
I
in
—
15.0
μA
Hi-Z (off-state) leakage current, V
in
2
=
3.3 V
1
I
TSI
V
OH
V
OL
V
OH
V
OL
C
—
15.0
μA
Output high voltage, I
OH
= -7
mA
2.4
—
V
Output low voltage, I
OL
= 7
mA
2
—
0.5
V
PCI 3.3 V signaling output high voltage, I
OH
= -0.5
mA
2
2.7
—
V
PCI 3.3 V signaling output low voltage, I
OL
= 1.5
mA
2
—
0.3
V
Capacitance, V
in
= 0 V, f = 1 MHz
3
in
—
7.0
pF
Notes:
1
Excludes test signals (LSSD_MODE and JTAG signals).
2
This value represents worst case 40-ohm drivers (default value for Processor/L2 control signals CI, WT, GBL, TBST,
TSIZ[0–2], TT[0–4], TWE, and TV) only. Other signals have lower default driver impedance and will support larger
I
OH
and I
OL
. All drivers may optionally be programmed to different driver strengths.
3
Capacitance is periodically sampled rather than 100% tested.