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參數(shù)資料
| 型號： | MP02XXX190 |
| 廠商： | Dynex Semiconductor Ltd. |
| 英文描述： | Phase Control Dual SCR, SCR/Diode Modules |
| 中文描述： | 相位控制雙可控硅，SCR /二極管模塊 |
| 文件頁數(shù)： | 3/10頁 |
| 文件大?。?/td> | 100K |
| 代理商： | MP02XXX190 |
MP02 XXX 190 Series
3/10
Symbol
Parameter
Conditions
Gate non-trigger voltage
V
Units
Max.
3.0
0.2
Typ.
mA
V
V
GD
Gate trigger voltage
200
V
GT
I
GT
Gate trigger current
V
DRM
= 5V, T
case
= 25
o
C
V
DRM
= 5V, T
case
= 25
o
C, R
L
= 6
V
DRM
= 5V, T
case
= 25
o
C, R
L
= 6
-
-
-
V
RGM
Peak reverse gate voltage
V
5.0
-
A
-
4
I
FGM
Peak forward gate current
Anode positive with respect to cathode
P
GM
P
G(AV)
Peak gate power
Mean gate power
-
-
16
3
W
W
Part number is made up as follows:
MP02 HBT 190 - 16
MP
02
HBT = Circuit configuration code (see "circuit options" - front page)
175
= Nominal average current rating at T
case
= 75
o
C
16
= V
RRM
/100
= Pressure contact module
= Outline type
Note: Diode ratings and characteristics are comparable with SCR in types HBP or HBN.
Types HBP or HBN can also be supplied with diode polarity reversed, to special order.
Examples:
MP02 HBP190-14
MP02 HBN190-12
Adequate heatsinking is required to maintain the base
temperature at 75
o
C if full rated current is to be achieved.
Power dissipation may be calculated by use of V
and r
T
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink if
required.
The heatsink surface must be smooth and flat; a surface finish
of N6 (32
μ
in) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to remove
oxide build up and foreign material. Care should be taken to
ensure no foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to ensure
optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the heatsink.
Using a torque wrench, slowly tighten the recommended fixing
bolts at each end, rotating each in turn no more than 1/4 of a
revolution at a time. Continue until the required torque of 6Nm
(55lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
GATE TRIGGER CHARACTERISTICS AND RATINGS
ORDERING INSTRUCTIONS
MOUNTING RECOMMENDATIONS
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| MP03HBT360-08 | Dual Thyristor, Thyristor/Diode Module |
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| MP03HBT360-14 | Dual Thyristor, Thyristor/Diode Module |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MP03 | 制造商:AURIS 制造商全稱:AURIS 功能描述:Quartz SMD |
| MP03/130-16 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03/130-18 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03/130-20 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03/175-10 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
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