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參數(shù)資料
| 型號(hào)： | MMBF0202PLT3 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 小信號(hào)晶體管 |
| 英文描述： | 300 mA, 20 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB |
| 封裝： | PLASTIC, CASE 318-08, 3 PIN |
| 文件頁(yè)數(shù)： | 34/34頁(yè) |
| 文件大?。?/td> | 356K |
| 代理商： | MMBF0202PLT3 |
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Packaging Specifications
6–6
Motorola Small–Signal Transistors, FETs and Diodes Device Data
TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H
F1
F2
P2
P1
P
D
W
W1
L1
W2
H2B
T1
T
T2
H4 H5
H1
Figure 1. Device Positioning on Tape
L
Specification
Inches
Millimeter
Symbol
Item
Min
Max
Min
Max
D
Tape Feedhole Diameter
0.1496
0.1653
3.8
4.2
D2
Component Lead Thickness Dimension
0.015
0.020
0.38
0.51
F1, F2
Component Lead Pitch
0.0945
0.110
2.4
2.8
H
Bottom of Component to Seating Plane
.059
.156
1.5
4.0
H1
Feedhole Location
0.3346
0.3741
8.5
9.5
H2A
Deflection Left or Right
0
0.039
0
1.0
H2B
Deflection Front or Rear
0
0.051
0
1.0
H4
Feedhole to Bottom of Component
0.7086
0.768
18
19.5
H5
Feedhole to Seating Plane
0.610
0.649
15.5
16.5
L
Defective Unit Clipped Dimension
0.3346
0.433
8.5
11
L1
Lead Wire Enclosure
0.09842
—
2.5
—
P
Feedhole Pitch
0.4921
0.5079
12.5
12.9
P1
Feedhole Center to Center Lead
0.2342
0.2658
5.95
6.75
P2
First Lead Spacing Dimension
0.1397
0.1556
3.55
3.95
T
Adhesive Tape Thickness
0.06
0.08
0.15
0.20
T1
Overall Taped Package Thickness
—
0.0567
—
1.44
T2
Carrier Strip Thickness
0.014
0.027
0.35
0.65
W
Carrier Strip Width
0.6889
0.7481
17.5
19
W1
Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2
Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7.
4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MMBF102 | 功能描述:射頻JFET晶體管 N-CHANNEL RoHS:否 制造商:NXP Semiconductors 配置:Single 晶體管極性:N-Channel 正向跨導(dǎo) gFS（最大值/最小值）: 電阻汲極/源極 RDS（導(dǎo)通）: 漏源電壓 VDS:40 V 閘/源截止電壓:5 V 閘/源擊穿電壓:40 V 最大漏極/柵極電壓:40 V 漏極電流（Vgs=0 時(shí)的 Idss）:25 mA to 75 mA 漏極連續(xù)電流: 功率耗散:250 mW 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-23 封裝:Reel |
| MMBF102LT1 | 制造商:Motorola Inc 功能描述: |
| MMBF1374T1 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MMBF170 | 功能描述:MOSFET N-Ch Enhance RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS（導(dǎo)通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:Max247 封裝:Tube |
| MMBF170 | 制造商:Fairchild Semiconductor Corporation 功能描述:MOSFET N SOT-23 |
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