參數(shù)資料
型號(hào): MMA2301DR2
廠商: Motorola, Inc.
英文描述: Surface Mount Micromachined Accelerometer
中文描述: 表面貼裝微加速度計(jì)
文件頁(yè)數(shù): 7/7頁(yè)
文件大小: 140K
代理商: MMA2301DR2
Motorola Sensor Device Data
MMA2301D
7
PACKAGE DIMENSIONS
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct footprint,
the packages will self-align when subjected to a solder reflow
process. It is always recommended to design boards with a
solder mask layer to avoid bridging and shorting between solder
pads.
DATE 05/17/01
CASE 475-01
ISSUE B
16 LEAD SOIC
C
K
SEATING
T
0.1
1
8
16
9
P
2 PLACES, 16 TIPS
0.15
D
0.13
16X
A
B
T
A
M
B
T
A
B
A
B
G
G/2
MILLIMETERS
MIN
10.15
7.40
3.30
0.35
0.76
1.27 BSC
DIM
A
B
C
D
F
G
J
K
M
P
R
0.25
0.10
0
10.16
0.25
MAX
10.45
7.60
3.55
0.49
1.14
0.32
0.25
7
10.67
0.75
R
X 45
J
F
M
NOTES:
1.
2.
3.
4.
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
DIMENSIONS "A" AND "B" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
PER SIDE.
DIMENSION "D" DOES NOT INCLUDE DAMBAR
PROTRUSION. PROTRUSIONS SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.75.
Figure 5. Footprint SOIC-16 (Case 475-01)
0.380 in.
9.65 mm
0.050 in.
1.27 mm
0.024 in.
0.610 mm
0.080 in.
2.03 mm
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
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