參數資料
型號： MM908E625ACDWB
廠商： 飛思卡爾半導體(中國)有限公司
英文描述： Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication
中文描述： 綜合四半僅符合電源橋，嵌入式微控制器和LIN串行通信
文件頁數： 47/48頁
文件大小： 615K
代理商： MM908E625ACDWB
Analog Integrated Circuit Device Data
Freescale Semiconductor
47
908E625
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Figure 28. Thermal Test Board
Device on Thermal Test Board
R
θ
JA
is the thermal resistance between die junction and
ambient air.
R
θ
JSmn
is the thermal resistance between die junction and
the reference location on the board surface near a center
lead of the package.
This device is a dual die package. Index
m
indicates the
die that is heated. Index
n
refers to the number of the die
where the junction temperature is sensed.
908E625 Terminal Connections
54-Terminal SOICW-EP
0.65 mm Pitch
17.9 mm x 7.5 mm Body
10.3 mm x 5.1 mm Exposed Pad
PTA0/KBD0
PTA1/KBD1
PTA2/KBD2
FLSVPP
PTA3/KBD3
PTA4/KBD4
VREFH
VDDA
EVDD
EVSS
VSSA
VREFL
PTE1/RXD
RXD
VSS
PA1
VDD
H1
H2
H3
HVDD
NC
HB4
VSUP3
GND2
HB3
HS
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTC4/OSC1
PTC3/OSC2
PTC2/MCLK
PTB5/AD5
PTB4/AD4
PTB3/AD3
IRQ
RST
PTB1/AD1
PTD0/TACH0/BEMF
PTD1/TACH1
NC
FGEN
BEMF
RST_A
IRQ_A
SS
LIN
NC
NC
HB1
VSUP1
GND1
HB2
VSUP2
1
2
3
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
9
11
6
7
8
4
5
54
53
52
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
44
48
46
51
49
EPad
A
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area
A
:
Cu heat-spreading areas on board
surface
Ambient Conditions:
Natural convection, still air
Table 15. Thermal Resistance Performance
Thermal
Resistance
Area A
(mm
2
)
1 = Power Chip, 2 = Logic Chip
(
°
C/W)
m
= 1,
n
= 1
m
= 1,
n
= 2
m
= 2,
n
= 1
m
= 2,
n
= 2
R
θ
JA
mn
0
53
48
53
300
39
34
38
600
35
30
34
R
θ
JS
mn
0
21
16
20
300
15
11
15
600
14
9.0
13
相關PDF資料
PDF描述
MM908E625 Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication(集成四半H橋，帶電源、嵌入式MCU和LIN串行通信功能)
MM908E626AVDWB Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication
MM908E626R2 Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication
MM908E626 Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication
MMA1200D Surface Mount Micromachined Accelerometer(表面安裝微電機加速計)
相關代理商/技術參數
參數描述
MM908E625ACDWB/R2 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication
MM908E625ACEK 功能描述:8位微控制器 -MCU Quad Half H-Bridge with P/S, HC08, LIN RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數據總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數據 RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT
MM908E625ACPEK 功能描述:8位微控制器 -MCU R0 HI-BRDG EMBED MCU LIN RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數據總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數據 RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT
MM908E626 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication
MM908E626AVDWB 功能描述:馬達/運動/點火控制器和驅動器 QUADSTEPPER RoHS:否 制造商:STMicroelectronics 產品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數量 廠商 批號 封裝
添加更多采購

我的聯系方式

*
*
*