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參數(shù)資料
| 型號： | MM908E624ACDWB/R |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO54 |
| 封裝： | PLASTIC, SOIC-54 |
| 文件頁數(shù)： | 25/34頁 |
| 文件大?。?/td> | 714K |
| 代理商： | MM908E624ACDWB/R |
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908E624ACDWBTAD
Rev 3.0, 01/2005
Freescale Semiconductor
Technical Data
Freescale Semiconductor, Inc., 2005. All rights reserved.
Integrated Triple High-Side
Switch with Embedded MCU
and LIN Serial Communication
for Relay Drivers
Thermal Addendum
Introduction
This thermal addendum is provided as a supplement to the
MM908E624 technical datasheet. The addendum provides thermal
performance information that may be critical in the design and
development of system applications. All electrical, application, and
packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The 908E624ACDWB is offered in a 54-terminal dual die package.
There are two heat sources in the package independently heating
with P1 and P2. This results in two junction temperatures, TJ1 and TJ2,
and a thermal resistance matrix with RθJAmn.
For m, n =1, RθJA11 is the thermal resistance from Junction 1 to
the reference temperature while only heat source 1 is heating with P1.
For m =1, n =2, RθJA12 is the thermal resistance from Junction 1
to the reference temperature while heat source 2 is heating with P2.
This applies to RθJ21 and RθJ22, respectively.
54-TERMINAL
SOICW
908E624ACDWB
DWB SUFFIX
98ASA99294D
54-TERMINAL SOICW
Note
For package dimensions, refer to the
MM908E624 datasheet.
TJ1
TJ2
=
RθJA11
RθJA21
RθJA12
RθJA22
.
P1
P2
The stated values are solely for a thermal performance
comparison of one package to another in a standardized
environment. This methodology is not meant to and will not
predict the performance of a package in an application-
specific environment. Stated values were obtained by
measurement and simulation according to the following
standards:
a. Per JEDEC JESD51-2 at natural convection, still air
condition.
b. 2s2p thermal test board per JEDEC JESD51-7.
c. Per JEDEC JESD51-8, with the board temperature on
the center trace near the center lead.
d. Single layer thermal test board per JEDEC JESD51-3.
e. Thermal resistance between the die junction and the
package top surface; assuming a cold plate mounted on
the package top surface.
Table 1. Thermal Performance Comparison
Thermal
Resistance
1 = Power Chip, 2 = Logic Chip (
°C/W)
m =1,
n =1
m =1, n =2
m =2, n =1
m =2,
n =2
RθJAmn
40
31
36
RθJBmn
25
16
21
RθJAmn
57
47
52
RθJCmn
21
12
16
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MM908E624ACDWBR2 | 功能描述:IC TRPL SWITCH MCU/LIN 54-SOIC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器 - 特定應用 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Aug/2009 標準包裝:250 系列:- 應用:網(wǎng)絡處理器 核心處理器:4Kc 程序存儲器類型:- 控制器系列:- RAM 容量:16K x 8 接口:以太網(wǎng)，UART，USB 輸入/輸出數(shù):- 電源電壓:1.8V, 3.3V 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:208-LQFP 包裝:帶卷 (TR) 供應商設備封裝:PG-LQFP-208 其它名稱:SP000314382 |
| MM908E624ACEW | 功能描述:開關 IC - 各種 TRIPLE HIGH SIDE SW RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel |
| MM908E624ACEW/R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Triple High Side Switch with Embedded MCU and LIN Serial Communicationfor Relay Drivers |
| MM908E624ACEWR2 | 功能描述:電源開關 IC - 配電 TRIPLE HIGH SIDE DRIVER RoHS:否 制造商:Exar 輸出端數(shù)量:1 開啟電阻（最大值）:85 mOhms 開啟時間（最大值）:400 us 關閉時間（最大值）:20 us 工作電源電壓:3.2 V to 6.5 V 電源電流（最大值）: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-23-5 |
| MM908E624ACPEW | 功能描述:8位微控制器 -MCU 3 HIGH SIDE SWITCH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
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