參數(shù)資料
型號(hào)： ML01618
廠商： Mitsubishi Electric Corporation
英文描述： 10Gb/s EA Modulator Driver IC
中文描述： 10Gb / s的電吸收調(diào)制器驅(qū)動(dòng)IC
文件頁數(shù)： 7/9頁
文件大小： 456K
代理商： ML01618
MITSUBISHI ICs for Optical Communication
M L 0 X X 1 8
10Gb/s EA Modulator Driver IC
PAD ASSIGNMENT (ML0CP18)
MITSUBISHI
ELECTRIC
- 7 -
Notice: This is not a final specification.
Some parametric limits are subject to change.
‘04/1/14 rev.2.1
Figure 7. Pad assignment of ML0CP18 (Bare Die)
The back side of die needs to be connected to GND. In other words, when VEE is supplied with
-5.2V, supply 0V to the backside. In the case of positive power supply (+5.2V to GND terminals and
0V to VEE), supply +5.2V to the backside. For the detailed information for the positive power supply
usage, please contact to your local rep.
The pads specified as NC need to be left “OPEN”.
Pad 19”GNDON”, pad 20”GNDO” and pad 36”GND” are not connected to “GND” line inside chip.
Connect these pads to GND externally.
1
2,300um
t=75um
1
2
3
4
5
6
22
21
20
19
18
17
12
11
10
9
8
7
16
14
13
15
38
23
24
25
26
27
28
29
3736 3534 33 32
31
30
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