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| 型號(hào)： | MK51DX256ZCMC10 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121 |
| 封裝： | 8 X 8 MM, MAPBGA-121 |
| 文件頁(yè)數(shù)： | 15/72頁(yè) |
| 文件大?。?/td> | 1005K |
| 代理商： | MK51DX256ZCMC10 |
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5.3.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
85
°C
5.3.2 Thermal attributes
Board type
Symbol
Description
121 MAPBGA
Unit
Notes
Single-layer (1s)
RθJA
Thermal
resistance, junction
to ambient (natural
convection)
TBD
°C/W
Four-layer (2s2p)
RθJA
Thermal
resistance, junction
to ambient (natural
convection)
TBD
°C/W
Single-layer (1s)
RθJMA
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
TBD
°C/W
Four-layer (2s2p)
RθJMA
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
TBD
°C/W
—
RθJB
Thermal
resistance, junction
to board
TBD
°C/W
—
RθJC
Thermal
resistance, junction
to case
TBD
°C/W
—
ΨJT
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
TBD
°C/W
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
3.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
General
K51 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
22
Preliminary
Freescale Semiconductor, Inc.
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