參數(shù)資料
型號(hào)： MCRF455
廠商： Microchip Technology Inc.
英文描述： 13.56 MHz Read/Write Passive RFID Device
中文描述： 13.56 MHz讀/寫無(wú)源RFID器件
文件頁(yè)數(shù)： 47/50頁(yè)
文件大?。?/td> 1172K
代理商： MCRF455
2003 Microchip Technology Inc.
DS40232H-page47
MCRF450/451/452/455
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
Your local Microchip sales office
2.
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3.
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
PART NO.
X
/XX
Package
Temperature
Range
Device
Device:
MCRF450:
13.56 MHz Anti-collision Read/Write
MicroID device w/no internal resonant
capacitor
MCRF450/7M:
COB (Chip-On-Board) module with dual
68 pF capacitor
MCRF451:
13.56 MHz Anti-collision Read/Write
MicroID device w/100 pF internal
resonant capacitor
MCRF452:
13.56 MHz Anti-collision Read/Write
MicroID device w/25 pF internal resonant
capacitor
MCRF455:
13.56 MHz Anti-collision Read/Write
MicroID device w/50 pF internal resonant
capacitor
Temperature Range:
= -20
°
C to +70
°
C
Package:
WF
= Sawed 8" wafer on frame (8 mil backgrind)
WFB
= Bumped, sawed 8" wafer on frame (8 mil
backgrind
W
= 8" wafer (11 mil backgrind)
WB
= Bumped 8" wafer (8 mil backgrind)
S
= Dice in waffle pack (8 mil backgrind)
SB
= Bumped die in waffle pack (8 mil backgrind)
X/SN
= SOIC (150 mil body), 8-lead (rotated pinout)
P
= PDIP (300 mil body), 8-lead
Examples:
a)
MCRF450/W:
13.56 MHz Anti-collision
Read/Write MicroID device, 1 Kbit, no cap, 8"
wafer, 11-mil backgrind.
b)
MCRF450/7M:
13.56 MHz Anti-collision
Read/Write MicroID COB (IST IOA2), 1 Kbit,
68 pF dual capacitor between antenna A and B,
antenna B and V
SS
. Thickness = 0.4 mm.
c)
MCRF451/WF:
13.56 MHz Anti-collision
Read/Write MicroID device, 1 Kbit, 100 pF
internal res cap, 8" wafer on frame, 8 mil
backgrind.
d)
MCRF451/S:
13.56 MHz Anti-collision
Read/Write MicroID device in waffle pack,
1 Kbit, 100 pF internal res cap, 8-mil
thickness.
e)
MCRF452/WFB:13.56 MHz Anti-collision
Read/Write MicroID bumped device for flip-
chip assembly, 1 Kbit, 50 pF dual (25 pF)
internal res cap, Bumped 8" wafer, 8-mil
backgrind wafer on frame.
f)
MCRF455X/SN: 13.56 MHz Anti-collision
Read/Write MicroID device in SOIC package,
1k bit, 50 pF internal res cap.
相關(guān)PDF資料
PDF描述
MCP450P 400000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
MCP450S 13.56 MHz Read/Write Passive RFID Device
MCP450SB 13.56 MHz Read/Write Passive RFID Device
MCP450SN 13.56 MHz Read/Write Passive RFID Device
MCP450W 13.56 MHz Read/Write Passive RFID Device
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