Voltage on V
參數(shù)資料
型號: MCP4331T-104E/ML
廠商: Microchip Technology
文件頁數(shù): 23/35頁
文件大小: 0K
描述: IC DGTL POT QUAD 100K 20QFN
標準包裝: 3,300
接片: 129
電阻(歐姆): 100k
電路數(shù): 4
溫度系數(shù): 標準值 150 ppm/°C
存儲器類型: 易失
接口: 4 線 SPI(芯片選擇)
電源電壓: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 20-VFQFN 裸露焊盤
供應商設備封裝: 20-QFN 裸露焊盤(4x4)
包裝: 帶卷 (TR)
2010 Microchip Technology Inc.
DS22242A-page 3
MCP433X/435X
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings
Voltage on VDD with respect to VSS ..... -0.6V to +7.0V
Voltage on CS, SCK, SDI, SDI/SDO, and
RESET with respect to VSS ..................... -0.6V to 12.5V
Voltage on all other pins (PxA, PxW, PxB and
SDO) with respect to VSS ............... -0.3V to VDD + 0.3V
Input clamp current, IIK
(VI < 0, VI > VDD, VI > VPP ON HV pins) ........... ±20 mA
Output clamp current, IOK
(VO < 0 or VO > VDD) ....................................... ±20 mA
Maximum output current sunk by any Output pin
........................................................................... 25 mA
Maximum output current sourced by any Output pin
........................................................................... 25 mA
Maximum current out of VSS pin ...................... 100 mA
Maximum current into VDD pin ......................... 100 mA
Maximum current into PXA, PXW and PXB pins
±2.5 mA Storage temperature ........... -65°C to +150°C
Ambient temperature with power applied
.......................................................... -40°C to +125°C
Package power dissipation
(TA = +50°C, TJ = +150°C) TSSOP-14 ......... 1000 mW
TSSOP-20......................................................1110 mW
QFN-20 (4x4) ................................................ 2320 mW
Soldering temperature of leads
(10 seconds) .................................................... +300°C
ESD protection on all pins
4 kV (HBM),
................................................................
300V (MM)
Maximum Junction Temperature (TJ) .............. +150°C
Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
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