參數(shù)資料
型號： MCP1725
廠商： Microchip Technology Inc.
英文描述： 500 mA, Low Voltage, Low Quiescent Current LDO Regulator
中文描述： 500毫安，低電壓，低靜態(tài)電流LDO穩(wěn)壓器
文件頁數(shù)： 20/32頁
文件大?。?/td> 1000K
代理商： MCP1725
MCP1725
DS22026A-page 20
2006 Microchip Technology Inc.
5.0
APPLICATION CIRCUITS/
ISSUES
5.1
Typical Application
The MCP1725 is used for applications that require high
LDO output current and a power good output.
FIGURE 5-1:
Typical Application Circuit.
5.1.1
APPLICATION CONDITIONS
5.2
Power Calculations
5.2.1
POWER DISSIPATION
The internal power dissipation within the MCP1725 is a
function of input voltage, output voltage, output current
and quiescent current.
Equation 5-1
can be used to
calculate the internal power dissipation for the LDO.
EQUATION 5-1:
P
LDO
Where:
In addition to the LDO pass element power dissipation,
there is power dissipation within the MCP1725 as a
result of quiescent or ground current. The power
dissipation as a result of the ground current can be
calculated using the following equation:
EQUATION 5-2:
The total power dissipated within the MCP1725 is the
sum of the power dissipated in the LDO pass device
and the P(I
GND
) term. Because of the CMOS
construction, the typical I
GND
for the MCP1725 is
120 μA. Operating at 3.465V results in a power
dissipation of 0.42 milli-Watts. For most applications,
this is small compared to the LDO pass device power
dissipation and can be neglected.
The
temperature specified for the MCP1725 is +125
°
C
.
To
estimate the internal junction temperature of the
MCP1725, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (R
θ
JA
) of the device. The thermal resistance
from junction to ambient for the 2x3 DFN package is
estimated at 76
°
C/W.
maximum
continuous
operating
junction
EQUATION 5-3:
Package Type
Input Voltage Range
V
IN
maximum
V
IN
minimum
V
DROPOUT (max)
V
OUT
(typical)
=
=
=
=
=
=
=
=
=
2x3 DFN8
3.3V ± 5%
3.465V
3.135V
0.350V
2.5V
0.5A maximum
0.4W
30.4
°
C
I
OUT
P
DISS
(typical)
Temperature Rise
V
IN
V
IN
SHDN
GND PWRGD
C
DELAY
Sense
V
OUT
1
2
3
4
5
6
7
8
10 μF
V
OUT
= 2.5V @ 0.5A
10 μF
V
IN
= 3.3V
On
Off
R
1
C
C
1000 pF
C
3
MCP1725-2.5
10k
Ω
PWRGD
V
IN MAX
)
)
V
OUT MIN
)
–
(
)
I
OUT MAX
)
)
×
=
P
LDO
=
LDO Pass device internal
power dissipation
Maximum input voltage
LDO minimum output voltage
V
IN(MAX)
V
OUT(MIN)
=
=
P
I GND
)
V
IN MAX
)
I
VIN
×
=
Where:
P
I(GND
=
Power dissipation due to the
quiescent current of the LDO
Maximum input voltage
Current flowing in the V
IN
pin
with no LDO output current
(LDO quiescent current)
V
IN(MAX)
=
=
I
VIN
T
J MAX
)
P
TOTAL
R
θ
JA
×
T
AMAX
+
=
T
J(MAX)
= Maximum continuous junction
temperature
P
TOTAL
= Total device power dissipation
R
θ
JA
= Thermal resistance from junction to
ambient
T
AMAX
= Maximum ambient temperature
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCP1725-0802E/MC 功能描述:低壓差穩(wěn)壓器 - LDO 500mA CMOS LDO Vout=0.8V RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
MCP1725-0802E/SN 功能描述:低壓差穩(wěn)壓器 - LDO 500mA CMOS LDO Vout=0.8V RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
MCP1725-1202E/MC 功能描述:低壓差穩(wěn)壓器 - LDO 500mA CMOS LDO Vout=1.2V RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
MCP1725-1202E/SN 功能描述:低壓差穩(wěn)壓器 - LDO 500mA CMOS LDO Vout=1.2V RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
MCP1725-1802E/MC 功能描述:低壓差穩(wěn)壓器 - LDO 500mA CMOS LDO Vout=1.8V RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
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