參數(shù)資料
型號: MCF5251
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: ColdFire Processor
中文描述: ColdFire處理器
文件頁數(shù): 24/32頁
文件大?。?/td> 290K
代理商: MCF5251
Package Information and Pinout
MCF5251 ColdFire Processor Data Sheet: Technical Data, Rev. 2.1
24
Freescale Semiconductor
5.2
Package Drawing
Figure 5
shows the package outline diagram for the MCF5251 processor.
Figure 5. MCF5251 Package Drawing
BOTTOM VIEW
SIDE VIEW
TOP VIEW
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing per ASME Y14. 5M–1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crown of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
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