參數(shù)資料
型號(hào)： MCF52223_07
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： ColdFire Microcontroller
中文描述： ColdFire微控制器
文件頁(yè)數(shù)： 30/56頁(yè)
文件大小： 962K
代理商： MCF52223_07
MCF52223 ColdFire Microcontroller, Rev. 2
Electrical Characteristics
Freescale Semiconductor
30
2.3
Thermal Characteristics
Table 22
lists thermal resistance values.
Table 22. Thermal Characteristics
Characteristic
Symbol
Value
Unit
100 LQFP
Junction to ambient, natural convection
Single layer board (1s)
θ
JA
θ
JA
θ
JMA
θ
JMA
θ
JB
θ
JC
Ψ
jt
53
1,2
1
θ
JA
and
Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JA
and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
Ψ
jt
parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
4
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
°
C / W
Junction to ambient, natural convection
Four layer board (2s2p)
39
1,3
°
C / W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
42
1,3
°
C / W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
33
1,3
°
C / W
Junction to board
—
25
4
°
C / W
Junction to case
—
9
5
°
C / W
Junction to top of package
Natural convection
2
6
°
C / W
Maximum operating junction temperature
—
T
j
θ
JA
θ
JA
θ
JMA
θ
JMA
θ
JB
θ
JC
Ψ
jt
105
o
C
81 MAPBGA Junction to ambient, natural convection
Single layer board (1s)
61
1,2
°
C / W
Junction to ambient, natural convection
Four layer board (2s2p)
35
2,3
°
C / W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
50
2,3
°
C / W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
31
2,3
°
C / W
Junction to board
—
20
4
°
C / W
Junction to case
—
12
5
°
C / W
Junction to top of package
Natural convection
2
6
°
C / W
Maximum operating junction temperature
—
T
j
θ
JA
θ
JA
θ
JMA
θ
JMA
θ
JB
θ
JC
Ψ
jt
105
o
C
64 LQFP
Junction to ambient, natural convection
Single layer board (1s)
62
1,2
°
C / W
Junction to ambient, natural convection
Four layer board (2s2p)
43
1,3
°
C / W
Junction to ambient (@200 ft/min)
Single layer board (1s)
50
1,3
°
C / W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
36
1,3
°
C / W
Junction to board
—
26
4
°
C / W
Junction to case
—
9
5
°
C / W
Junction to top of package
Natural convection
2
6
°
C / W
Maximum operating junction temperature
—
T
j
105
o
C
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