參數(shù)資料
型號(hào): MCF51AC256AVFUE
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 50.33 MHz, MICROCONTROLLER, PQFP64
封裝: 14 X 14 MM, LEAD FREE, QFP-64
文件頁(yè)數(shù): 8/46頁(yè)
文件大?。?/td> 1036K
代理商: MCF51AC256AVFUE
MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.4
Electrical Characteristics
Freescale Semiconductor
16
2.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or
VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
loads), the difference between pin voltage and VSS or VDD will be very small.
Table 6. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to 5.8
V
Input voltage
VIn
–0.3 to VDD + 0.3
V
Instantaneous maximum current
Single pin limit (applies to all port pins)1, 2, 3
1 Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2 All functional non-supply pins are internally clamped to V
SS and VDD.
3 Power supply must maintain regulation within operating V
DD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may flow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low which would reduce overall power
consumption.
ID
±25
mA
Maximum current into VDD
IDD
120
mA
Storage temperature
Tstg
–55 to 150
°C
Table 7. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
–40 to 105
°C
Maximum junction temperature
TJ
150
°C
Thermal resistance 1,2,3,4
80-pin LQFP
1s
2s2p
64-pin LQFP
1s
2s2p
64-pin QFP
1s
2s2p
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation
of other components on the board, and board thermal resistance
θ
JA
51
38
59
41
50
36
°C/W
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