參數資料
型號: MC8641HX1000GB
廠商: Freescale Semiconductor
文件頁數: 30/130頁
文件大?。?/td> 0K
描述: IC MPU SGL E600 CORE 994FCCBGA
標準包裝: 1
系列: MPC86xx
處理器類型: 32-位 MPC86xx PowerPC
速度: 1.0GHz
電壓: 1.05V
安裝類型: 表面貼裝
封裝/外殼: 994-BCBGA,FCCBGA
供應商設備封裝: 994-FCCBGA(33x33)
包裝: 托盤
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
125
System Design Information
Figure 68. JTAG/COP Interface Connection for one MPC8641 device
HRESET
From Target
Board Sources
COP_HRESET
13
COP_SRESET
SRESET1
NC
11
COP_VDD_SENSE2
6
5
15
10
Ω
10 k
Ω
10 k
Ω
COP_CHKSTP_IN
CKSTP_IN
8
COP_TMS
COP_TDO
COP_TDI
COP_TCK
TMS
TDO
TDI
9
1
3
4
COP_TRST
7
16
2
10
12
(if any)
CO
P
Head
er
14 3
3. The KEY location (pin 14) is not physically present on the COP header.
10 k
Ω
TRST1
10 k
Ω
10 k
Ω
10 k
Ω
CKSTP_OUT
COP_CHKSTP_OUT
3
13
9
5
1
6
10
15
11
7
16
12
8
4
KEY
No pin
COP Connector
Physical Pinout
1
2
NC
SRESET1
NC
OVDD
10 k
Ω
10 k
Ω
HRESET1
4. Although pin 12 is defined as a No-Connect, some debug tools may use pin 12 as an additional GND pin for
improved signal integrity.
TCK
4
5
5. This switch is included as a precaution for BSDL testing. The switch should be open during BSDL testing to avoid
accidentally asserting the TRST line. If BSDL testing is not being performed, this switch should be closed or removed.
10 k
Ω
SRESET0
10 k
Ω
SRESET0
2. Populate this with a 10
Ω resistor for short-circuit/current-limiting protection.
1. The COP port and target board should be able to independently assert HRESET and TRST to the processor
in order to fully control the processor as shown here.
Notes:
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MC8641HX1000GC 功能描述:IC MPU SGL E600 CORE 994FCCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC86xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,FCBGA 供應商設備封裝:783-FCPBGA(29x29) 包裝:托盤
MC8641HX1000GE 功能描述:微處理器 - MPU G8 REV 3.0 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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