參數(shù)資料
型號： MC8641DVU1000NE
廠商： Freescale Semiconductor
文件頁數(shù)： 15/130頁
文件大?。?/td> 0K
描述： IC MPU DUAL CORE E600 1023FCCBGA
標準包裝： 1
系列： MPC86xx
處理器類型： 32-位 MPC86xx PowerPC
速度： 1.0GHz
電壓： 0.95V
安裝類型： 表面貼裝
封裝/外殼： 1023-BCBGA，F(xiàn)CCBGA
供應商設(shè)備封裝： 1023-FCCBGA（33x33）
包裝： 托盤
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
111
Thermal
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
19.2.1
Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 71, the intrinsic conduction thermal
resistance paths are as follows:
The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
The die junction-to-board thermal resistance
Figure 60 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 60. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be neglected
for a first-order analysis. Thus the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
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