
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
9
Electrical Characteristics
Junction temperature range
TJ
0 to 105
C
C—
Notes:
1. Core 1 characteristics apply only to MPC8641D
2. If two separate power supplies are used for VDD_Core0 and VDD_Core1, they must be at the same nominal voltage and the
individual power supplies must be tracked and kept within 100 mV of each other during normal run time.
3. Caution: D
n
_MV
IN must meet the overshoot/undershoot requirements for Dn_GVDD as shown in Figure 2. 4. Caution: L/TVIN must meet the overshoot/undershoot requirements for L/TVDD as shown in Figure 2 during regular run time. 5. Caution: OVIN must meet the overshoot/undershoot requirements for OVDD as shown in Figure 2 during regular run time. 6. Timing limitations for M,L,T,O)VIN and Dn_MVREF during regular run time is provided in Figure 2 7. Applies to devices marked with a core frequency of 1333 MHz and below. Refer to
Table 74 Part Numbering Nomenclature
to determine if the device has been marked for a core frequency of 1333 MHz and below.
8. Applies to devices marked with a core frequency above 1333 MHz. Refer to
Table 74 Part Numbering Nomenclature to
determine if the device has been marked for a core frequency above 1333 MHz.
9. The 2.5 V ± 125 mV range is for DDR and 1.8 V ± 90 mV range is for DDR2.
operating conditions per protocol.
11. The PCI Express interface of the device is expected to receive signals from 0.175 to 1.2 V. For more information refer to
12. Applies to Part Number MC8641xxx1000NX only. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V devices. Refer to Table 74 Part Numbering Nomenclature to determine if the device has been marked for VDD_Coren = 0.95 V.
the voltage at the AVDD_Coren pin, which may be reduced from VDD_Coren by the filter.
Table 2. Recommended Operating Conditions (continued)
Characteristic
Symbol
Recommended
Value
Unit
Notes