參數(shù)資料
型號: MC68HC705C9ACFN
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: Microcontrollers
中文描述: 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PQCC44
封裝: PLASTIC, LCC-44
文件頁數(shù): 133/160頁
文件大?。?/td> 2076K
代理商: MC68HC705C9ACFN
Electrical Specifications
Thermal Characteristics
MC68HC705C9A — Rev. 4.0
Advance Information
MOTOROLA
Electrical Specifications
For More Information On This Product,
Go to: www.freescale.com
133
12.4 Thermal Characteristics
12.5 Power Considerations
The average chip-junction temperature, T
J
, in
°
C, can be obtained from:
T
J
= T
A
+ (P
D
×
θ
JA
)
(1)
where:
T
A
= Ambient temperature,
°
C
θ
JA
= Package thermal resistance, junction to ambient,
°
C/W
P
D
= P
INT
+ P
I
/
O
P
INT
= I
DD
×
V
DD
watts (chip internal power)
P
I
/
O
= Power dissipation on input and output pins (user determined)
For most applications P
I
/
O
P
INT
and can be neglected.
The following is an approximate relationship between P
D
and T
J
(neglecting P
J
):
P
D
= K
÷
(T
J
+ 273
°
C)
(2)
Solving equations (1) and (2) for K gives:
K = P
D
×
(T
A
+ 273
°
C) +
θ
JA
×
(P
D
)
2
(3)
where K is a constant pertaining to the particular part. K can be
determined from equation (3) by measuring P
D
(at equilibrium) for a
known T
A
. Using this value of K, the values of P
D
and T
J
can be obtained
by solving equations (1) and (2) iteratively for any value of T
A
.
Characteristic
Symbol
Value
Unit
Thermal resistance plastic dual in-line (PDIP)
θ
JA
60
°
C/W
Thermal resistance plastic leaded chip carrier
(PLCC)
θ
JA
70
°
C/W
Thermal resistance quad flat pack (QFP)
θ
JA
95
°
C/W
Thermal resistance plastic shrink DIP (SDIP)
θ
JA
60
°
C/W
F
Freescale Semiconductor, Inc.
n
.
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