JA) can be separated into t" />
鍙冩暩璩囨枡
鍨嬭櫉锛� MC68EC030FE25CB1
寤犲晢锛� Freescale Semiconductor
鏂囦欢闋佹暩锛� 14/36闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC MPU 32BIT ENH 25MHZ 132-CQFP
妯欐簴鍖呰锛� 180
绯诲垪锛� M680x0
铏曠悊鍣ㄩ鍨嬶細 M680x0 32-浣�
閫熷害锛� 25MHz
闆诲锛� 5V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
灏佽/澶栨锛� 132-BCQFP
渚涙噳鍟嗚ō鍌欏皝瑁濓細 132-CQFP锛�24x24锛�
鍖呰锛� 鎵樼洡
MOTOROLA
MC68EC030 TECHNICAL DATA
2 1
The total thermal resistance of a package (
JA) can be separated into two components, JC and CA,
representing the barrier to heat flow from the semiconductor junction to the package (case) surface (
JC)
and from the case to the outside ambient air (
CA). These terms are related by the equation:
JA=JC + CA
(4)
JC is device related and cannot be influenced by the user. However, CA is user dependent and can
be minimized by such thermal management techniques as heat sinks, ambient air cooling, and thermal
convection. Thus, good thermal management on the part of the user can significantly reduce
CA so that
JA approximately equals; JC. Substitution of JC for JA in equation (1) results in a lower
semiconductor junction temperature.
Values for thermal resistance presented in this document, unless estimated, were derived using the
procedure described in Motorola Reliability Report 7843, 鈥淭hermal Resistance Measurement Method for
MC68XX Microcomponent Devices,鈥� and are provided for design purposes only. Thermal measurements
are complex and dependent on procedure and setup. User derived values for thermal resistance may
differ.
AC ELECTRICAL SPECIFICATION DEFINITIONS
The AC specifications presented consist of output delays, input setup and hold times, and signal skew
times. All signals are specified relative to an appropriate edge of the clock and possibly to one or more
other signals.
The measurement of the AC specifications is defined by the waveforms shown in Figure 9. To test the
parameters guaranteed by Motorola, inputs must be driven to the voltage levels specified in Figure 9.
Outputs are specified with minimum and/or maximum limits, as appropriate, and are measured as shown in
Figure 9. Inputs are specified with minimum setup and hold times, and are measured as shown. Finally,
the measurement for signal-to-signal specifications is also shown.
Note that the testing levels used to verify conformance to the AC specifications does not affect the
guaranteed DC operation of the device as specified in the DC electrical specifications.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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MC68EC030FE40C 鍔熻兘鎻忚堪:寰檿鐞嗗櫒 - MPU 32B ON-CHIP CACHE RoHS:鍚� 鍒堕€犲晢:Atmel 铏曠悊鍣ㄧ郴鍒�:SAMA5D31 鏍稿績:ARM Cortex A5 鏁告摎绺界窔瀵害:32 bit 鏈€澶ф檪閻橀牷鐜�:536 MHz 绋嬪簭瀛樺劜鍣ㄥぇ灏�:32 KB 鏁告摎 RAM 澶у皬:128 KB 鎺ュ彛椤炲瀷:CAN, Ethernet, LIN, SPI,TWI, UART, USB 宸ヤ綔闆绘簮闆诲:1.8 V to 3.3 V 鏈€澶у伐浣滄韩搴�:+ 85 C 瀹夎棰ㄦ牸:SMD/SMT 灏佽 / 绠遍珨:FBGA-324
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