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Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33990
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
V
BAT DC Supply Voltage (1) VBAT
-16 to 40
V
VI/O(CPU)
-0.3 to 7.0
V
BUS and LOAD Outputs
VBUS
-2.0 to 16
V
ESD Voltage
VESD1
VESD2
±2000
±200
V
Storage Temperature
TSTG
-65 to 150
°C
Operating Ambient Temperature
TA
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Peak Package Reflow Temperature During Reflow
(5), (6)TPPRT
°C
Thermal Resistance (Junction-to-Ambient)
RθJ-A
180
°C/W
Notes
1.
An external series diode must be used to provide reverse battery protection of the device.
2.
SLEEP
, TX, RX, and 4X/LOOP are normally connected to a microcontroller.
3.
ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω).
4.
ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω).
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6.