參數(shù)資料
型號: MC33888FB
廠商: MOTOROLA INC
元件分類: 外設(shè)及接口
英文描述: Quad High-Side and Octal Low-Side Switch for Automotive
中文描述: 40 A BUF OR INV BASED PRPHL DRVR, PQFP64
封裝: 0.65 MM PITCH, MO-188, POWER PACK-64
文件頁數(shù): 27/32頁
文件大?。?/td> 667K
代理商: MC33888FB
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33888
27
PACKAGE INFORMATION
Soldering Information
The 33888 is packaged in a surface mount power package
intended to be soldered directly onto the printed circuit board.
The device was qualified in accordance with JEDEC
standards JESD22-A113-B and J-STD-020A. The
recommended reflow conditions are as follows:
Convection: 225°C +5.0°C/-0°C
Vapor Phase Reflow (VPR): 215°C to 219°C
Infrared (IR)/Convection: 225°C +5.0°C/-0°C
The maximum peak temperature during the soldering
process should not exceed 230°C. The time at maximum
temperature should range from 10 seconds to 40 seconds
maximum.
APPLICATIONS
Typical Application
Figure 9
shows a typical application for the 33888.
Figure 9. 33888 Typical Application Diagram
RST
SPI
V
33888
FS
IHS0:IHS3
ILS
WDIN
CSNS2-3
CSNS0-1
FSI
8 x Relay or LED
V
DD
V
PWR
V
PWR
MCU
65 W
Loads
+5.0 V
+5.0 V
4
4
GND
65 W
21 W 5.0 W
21 W 5.0 W
10 k
8 x 0.5
40 m
40 m
10 m
10 m
A/D
A/D
R
C1
R
C2
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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