參數(shù)資料
型號: MC33886
廠商: Motorola Mobility Holdings, Inc.
英文描述: 5.0 A H BRIDGE
中文描述: 5.0AH - 橋
文件頁數(shù): 4/20頁
文件大?。?/td> 637K
代理商: MC33886
33886
4
Go to: www.freescale.com
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Supply Voltage
V+
40
V
Input Voltage (Note 1)
V
IN
-0.1 to 7.0
V
FS Status Output (Note 2)
V
FS
7.0
V
Continuous Current (Note 3)
I
OUT
5.0
A
ESD Voltage for DH Package
Human Body Model (Note 4)
Machine Model (Note 5)
V
ESD1
V
ESD2
±2000 (Note 6)
±200
V
ESD Voltage for VW Package
Human Body Model (Note 4)
Machine Model (Note 5)
V
ESD1
V
ESD2
±2000
±200
V
Storage Temperature
T
STG
-65 to 150
°
C
Ambient Operating Temperature (Note 7)
T
A
-40 to 125
°
C
Operating Junction Temperature
T
J
-40 to 150
°
C
Terminal Soldering Temperature (Note 8)
DH Suffix
VW (Pb-Free Suffix)
T
SOLDER
220
260
°
C
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W) (Note 9)
R
θ
JB
~5.0
°
C/W
Notes
1.
2.
3.
4.
5.
6.
Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
Exceeding the pull-up resistor voltage on the open drain FS terminal may cause permanent damage to the device.
Continuous current capability so long as junction temperature is
150
°
C.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
).
All terminals are capable of Human Body Model ESD voltages of ±2000 V with two exceptions pertaining only to the DH suffix package:
(1) D2 to PGND is capable of ±1500 V and (2) OUT1 to AGND is capable of ±1000 V.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Exposed heatsink pad plus the power and ground terminals comprise the main heat conduction paths. The actual R
θ
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace.
7.
8.
9.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
n
.
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