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| 型號(hào)： | MC33394DH |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 41/44頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC POWER SUPPLY MULT-OUT 44-HSOP |
| 標(biāo)準(zhǔn)包裝： | 30 |
| 應(yīng)用： | Motorola MPC55x、MPC56x 微處理器 |
| 接口： | SPI 串行 |
| 電源電壓： | 4 V ~ 26.5 V |
| 封裝/外殼： | 44-BSSOP（0.433"，11.00mm 寬）裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 44-HSOP |
| 包裝： | 管件 |
| 安裝類型： | 表面貼裝 |
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33394
6
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
1. MAXIMUM RATINGS (Maximum Ratings indicate sustained limits beyond which damage to the device may occur.
Voltage parameters are absolute voltages referenced to ground.)
Parameter
Min.
Max.
Unit
Supply Voltage (VBAT), Load Dump
–0.3
+45
V
Supply Voltage (KA_VBAT, VIGN), Load Dump
–18
+45
V
Supply Voltages (VDDH, VPP, VDD3_3, VDDL, VKAM)
–0.3
+5.8
V
Supply Voltages (VREF1, VREF2, VREF3, VSEN)
–2.0
+18
V
CANL, CANH (0<VBAT<18 VDC no time limit)
–18
+26.5
V
ESD Voltage
Human Body Model all pins
(Note 1)
Machine Model all pins
(Note 2)
–2.0
–200
+2.0
+200
kV
V
CANLesd, CANHesd
(Note 1)
–4.0
+4.0
kV
CANLesd, CANHesd
(Note 2)
–200
+200
V
CANLtransient, CANHtransient
(Note 3)
–200
+200
V
/SLEEP
–18
+45
V
REGON, VPP_EN, /HRESET, /PORESET, /PRERESET, HRT, DO, DI, CS, SCLK
–0.3
+7.0
V
CANTXD, CANRXD
–0.3
+7.0
V
Operational Package Temperature [Ambient Temperature]
–40
+125
°C
Storage Temperature
–65
+150
°C
Power Dissipation (TA = 125_C)
44 HSOP
(Note 4)
44 QFN
(Note 4)
54 SOICW–EP
(Note 4)
8.3
5.0
W
Lead Soldering Temperature
(Note 5)
260
_C
Maximum Junction Temperature
+150
°C
R
θJA, Thermal Resistance, Junction to Ambient (44 HSOP)
(Note 6)
41
°C/W
R
θJC, Thermal Resistance, Junction to Case (44 HSOP)
(Note 7)
0.2
°C/W
R
θJB, Thermal Resistance, Junction to Base (44 HSOP)
(Note 8)
3
°C/W
R
θJA, Thermal Resistance, Junction to Ambient (44 QFN)
(Note 6)
77
°C/W
R
θJC, Thermal Resistance, Junction to Case (44 QFN)
(Note 7)
1.7
°C/W
R
θJB, Thermal Resistance, Junction to Base (44 QFN)
(Note 8)
5.0
°C/W
R
θJA, Thermal Resistance, Junction to Ambient (54 SOICW–EP)
(Note 6)
52
°C/W
R
θJC, Thermal Resistance, Junction to Case (54 SOICW–EP)
(Note 7)
1.2
°C/W
R
θJB, Thermal Resistance, Junction to Base (54 SOICW–EP)
(Note 8)
8.1
°C/W
1. Human body model: C = 100 pF, R = 1.5 k
.
2. Machine model: C = 200 pF, R = 10
and L = 0.75 H. In case of a discharge from pin CANL to pin GND: – 100 V < CANL transient < +100
V; in case of a discharge from pin CANH to Vcc: –150 V < CANH transient < +150 V.
3. The waveforms of the applied transients is in accordance with ”ISO 7637 part 1” test pulses 1, 2, 3a and 3b.
4. Maximum power dissipation at indicated junction temperature.
5. Lead soldering temperature limit is for 10 seconds maximum duration; contact Motorola Sales Office for device immersion soldering
time/temperature limits.
6. Thermal resistance measured in accordance with EIA/JESD51–2.
7. Theoretical thermal resistance from the die junction to the exposed pad.
8. Thermal resistance measured in accordance with JESD51–8.
2. RECOMMENDED OPERATING CONDITIONS (All voltages are with respect to ground unless otherwise noted)
Parameter
Value
Unit
Supply Voltages (VBAT, KA_VBAT)
4.0 to 26.5
V
Switching Regulator Output Current (IVPRE)
(Note 1)
0 to 1.2
A
VDDH Output Current
0 to 400
mA
VDD3_3 Output Current
0 to 120
mA
VDDL_B Pass Transistor Base Drive Current
0 to 40
mA
VPP Output Current
0 to 150
mA
VREF Output Current
0 to 100
mA
VSEN Output Current
0 to 125
mA
VKAM Standby Output Current (normal mode of operation)
0 to 60
mA
VKAM Standby Output Current (standby mode of operation)
0 to 12
mA
1. See Typical Application Diagram in Figure 1.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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