參數(shù)資料
型號： MC33298DWR2
廠商： Freescale Semiconductor
文件頁數(shù)： 24/28頁
文件大?。?/td> 0K
描述： IC OCTAL SERIAL SWITCH 24-SOIC
標(biāo)準(zhǔn)包裝： 1
類型： 低端
輸入類型： SPI
輸出數(shù)： 8
導(dǎo)通狀態(tài)電阻： 350 毫歐
電流 - 輸出 / 通道： 1A
電流 - 峰值輸出： 4A
電源電壓： 9 V ~ 26.5 V
工作溫度： -40°C ~ 125°C
安裝類型： 表面貼裝
封裝/外殼： 24-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 24-SOIC W
包裝： 剪切帶 (CT)
其它名稱： MC33298DWCT
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33298
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ARCHIVE
INFORMATION
ARCHIVE
INFORMATION
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
Power Supply Voltage
Normal Operation (Steady-state)
Transient Conditions(1)
VPWR(SS)
VPWR(PK)
- 1.5 to 26.5
- 13 to 60
V
Logic Supply Voltage(2)
VDD
- 0.3 to 7.0
V
Input pin Voltage(3)
VIN
- 0.3 to 7.0
V
Output Clamp Voltage(4)
2.0mA
≤ IOUT ≤ 0.5A
VOUT(OFF)
50 to 75
V
Output Self-Limit Current
IOUT(LIM)
3.0 to 6.0
A
Continuous Per Output Current(5)
IOUT(CONT)
1.0
A
ESD Voltage(6)
Human Body Model(7)
Machine Model(7)
VESD1
VESD2
2000
200
V
Output Clamp Energy(8)
Repetitive:
TJ = 25°C
TJ = 124°C
Non-Repetitive:
TJ = 25°C
TJ = 124°C
ECLAMP
100
30
2.0
0.5
mJ
J
Recommended Frequency of SPI Operation(9)
fSPI
2.0
MHz
Storage Temperature
TSTG
- 55 to 150
°C
Peak Package Reflow Temperature During Reflow(10),(11)
TPPRT
°C
Notes
1.
Transient capability with external 100
Ω resistor in series with VP pin and supply.
2.
Exceeding these limits may cause a malfunction or permanent damage to the device.
3.
Exceeding the limits on SCLK, SI, CS, SFPD, or RST pins may cause permanent damage to the device.
4.
With output OFF.
5.
Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125
°C ambient temperature
will require maximum output current computation using package RθJA.
6.
ESD data available upon request.
7.
ESD1 testing is performed in accordance with the Human Body Model (CZap = 200pF, RZap = 1500Ω), ESD2 testing is performed in
accordance with the Machine Model (CZap = 200pF, RZap = 0Ω).
8.
Maximum output clamp energy capability at 150
°C junction temperature using a single non-repetitive pulse method.
9.
Guaranteed and production tested for 2.0MHz SPI operation, but demonstrated to operate to 8.5MHz at 25
°C.
10.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
11.
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