參數(shù)資料
型號(hào): MC33151D
廠商: ON SEMICONDUCTOR
元件分類: MOSFETs
英文描述: High Speed Dual MOSFET Drivers
中文描述: 1.5 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8
封裝: SOIC-8
文件頁(yè)數(shù): 7/12頁(yè)
文件大?。?/td> 284K
代理商: MC33151D
MC34151, MC33151
http://onsemi.com
7
LAYOUT CONSIDERATIONS
High frequency printed circuit layout techniques are
imperative to prevent excessive output ringing and overshoot.
Do not attempt to construct the driver circuit on
wire–wrap or plug–in prototype boards.
When driving
large capacitive loads, the printed circuit board must contain
a low inductance ground plane to minimize the voltage spikes
induced by the high ground ripple currents. All high current
loops should be kept as short as possible using heavy copper
runs to provide a low impedance high frequency path. For
optimum drive performance, it is recommended that the
initial circuit design contains dual power supply bypass
capacitors connected with short leads as close to the VCC pin
and ground as the layout will permit. Suggested capacitors are
a low inductance 0.1
μ
F ceramic in parallel with a 4.7
μ
F
tantalum. Additional bypass capacitors may be required
depending upon Drive Output loading and circuit layout.
Proper printed circuit board layout is extremely
critical and cannot be over emphasized.
The MC34151 greatly enhances the drive capabilities of common switching
regulators and CMOS/TTL logic devices.
Figure 18. Enhanced System Performance with
Common Switching Regulators
Figure 19. MOSFET Parasitic Oscillations
Figure 20. Direct Transformer Drive
Figure 21. Isolated MOSFET Drive
Series gate resistor Rg may be needed to damp high frequency parasitic
oscillations caused by the MOSFET input capacitance and any series
wiring inductance in the gate–source circuit. Rg will decrease the
MOSFET switching speed. Schottky diode D1 can reduce the driver’s
power dissipation due to excessive ringing, by preventing the output pin
frombeing driven below ground.
Output Schottky diodes are recommended when driving inductive loads at
high frequencies. The diodes reduce the driver’s power dissipation by
preventing the output pins frombeing driven above VCC and below ground.
+
5.7V
VCC
47
0.1
6
TL494
or
TL594
2
4
3
1
1
7
5
Vin
+
+
+
+
+
+
1
1N5819
D1
Rg
Vin
+
+
1
1
3
7
5
4 X
1N5819
+
+
+
+
3
1
1N
5819
Isolation
Boundary
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC33151DG 功能描述:功率驅(qū)動(dòng)器IC 1.5A High Speed Dual Inverting MOSFET RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
MC33151DR2 功能描述:功率驅(qū)動(dòng)器IC 1.5A High Speed Dual RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
MC33151DR2G 功能描述:功率驅(qū)動(dòng)器IC 1.5A High Speed Dual Inverting MOSFET RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
MC33151P 功能描述:功率驅(qū)動(dòng)器IC 1.5A High Speed Dual RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
MC33151PG 功能描述:功率驅(qū)動(dòng)器IC 1.5A High Speed Dual Inverting MOSFET RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube