
MC144110 Technical Data, Rev. 2
10
Freescale Semiconductor
Packaging
5
Packaging
Figure 7. Outline Dimensions for P SUFFIX, PLASTIC DIP
(CASE 707-02, Issue C)
Figure 8. Outline Dimensions for DW SUFFIX, SOG
(CASE 751D-06, Issue H)
1
SEATING
PLANE
10
9
18
M
A
B
K
C
N
F
G
D
H
J
L
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
22.22
23.24
0.875
0.915
B
6.10
6.60
0.240
0.260
C
3.56
4.57
0.140
0.180
D
0.36
0.56
0.014
0.022
F
1.27
1.78
0.050
0.070
G
2.54 BSC
0.100 BSC
H
1.02
1.52
0.040
0.060
J
0.20
0.30
0.008
0.012
K
2.92
3.43
0.115
0.135
L
7.62 BSC
0.300 BSC
M
0
15
0
15
N
0.51
1.02
0.020
0.040
NOTES:
1.
2.
3.
4.
POSITIONAL TOLERANCE OF LEADS (D).
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
CONTROLLING DIMENSION: INCH.
20
11
10
1
PIN
NUMBER
PIN 1 INDEX
10X
7.6
7.4
12.95
12.65
0.25
0.10
2.65
2.35
10.55
10.05
5
4
6
B
T
A
M
0.25
B
20X
SEATING PLANE
0.1 T
M
0.25
T A B
20X
18X
0.49
0.35
1.27
0.75
0.25
AA
0.32
0.23
1.0
0.4
7
0
X45
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
DATUMS A AND B TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15mm PER SIDE. THIS DIMENSION
IS DETERMINED AT THE PLANE WHERE THE
BOTTOM OF THE LEADS EXIT THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE INTER-LEAD
FLASH OR PROTRUSIONS. INTER-LEAD FLASH
AND PROTRUSIONS SHALL NOT EXCEED 0.25mm
PER SIDE. THIS DIMENSION IS DETERMINED AT
THE PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE WIDTH TO EXCEED 0.62mm.
SECTION A-A