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參數(shù)資料
| 型號： | MBRS1100 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Schottky Power Rectifier(Surface Mount Power Package) |
| 中文描述： | 2 A, 100 V, SILICON, RECTIFIER DIODE |
| 封裝： | CASE 403A-03, SMB, 2 PIN |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 77K |
| 代理商： | MBRS1100 |
3
Rectifier Device Data
INFORMATION FOR USING THE SMB SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to insure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
mm
inches
0.085
2.159
0.108
2.743
0.089
2.261
MOUNTING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and soldering
should be 100
°
C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10
°
C.
The soldering temperature and time shall not exceed
260
°
C for more than 5 seconds.
When shifting from preheating to soldering, the maximum
temperature gradient shall be 5
°
C or less.
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
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| MBRS1100T3 | 1 Amp Schottky Rectifier |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MBRS1100-FL | 制造商:GXELECTRONICS 制造商全稱:Gaomi Xinghe Electronics Co., Ltd. 功能描述:Low power loss,high efficiency |
| MBRS1100T3 | 功能描述:肖特基二極管與整流器 1A 100V RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
| MBRS1100T3_07 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Schottky Power Rectifier Surface Mount Power Package |
| MBRS1100T3G | 功能描述:肖特基二極管與整流器 1A 100V RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
| MBRS1100T3G | 制造商:ON Semiconductor 功能描述:DIODE, SCHOTTKY, 1A, 100V, SMB |
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