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參數(shù)資料
| 型號： | MB9BF504RPMC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP120 |
| 封裝： | 16 X 16 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-120 |
| 文件頁數(shù)： | 61/120頁 |
| 文件大?。?/td> | 1277K |
| 代理商： | MB9BF504RPMC |
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MB9B500 Series
PRECAUTIONS FOR HANDLING THE DEVICES
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly
affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This
page describes precautions that must be observed to minimize the chance of failure and to obtain higher
reliability from your FUJITSU semiconductor devices.
Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
·
Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
·
Recommended Operating Conditions
The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the
data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
·
Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to
power supply and input/output functions.
1. Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause
deterioration within the device, and in extreme cases leads to permanent damage of the device. Try
to prevent such overvoltage or over-current conditions at the design stage.
2. Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can
cause large current flows. Such conditions if present for extended periods of time can damage the
device.
Therefore, avoid this type of connection.
3. Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of operation.
Such pins should be connected through an appropriate resistance to a power supply pin or ground
pin.
·
Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate.
When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor
structures) may be formed, causing large current levels in excess of several hundred mA to flow
continuously at the power supply pin. This condition is called latch-up.
Note:
The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but
can cause injury or damage from high heat, smoke or flame. To prevent this from happening,
do the following:
(a) Be sure that voltages applied to pins do not exceed the absolute maximum ratings.
This should include attention to abnormal noise, surge levels, etc.
(b) Be sure that abnormal current flows do not occur during the power-on sequence.
45
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r5.0
DS706-00010-1v0-E
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MB9BF504RPMC-GE1 | 功能描述:IC MCU 32BIT 256KB FLASH 120LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:FM3 MB9B500 產(chǎn)品培訓(xùn)模塊:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 標(biāo)準(zhǔn)包裝:90 系列:AVR® XMEGA 核心處理器:AVR 芯體尺寸:8/16-位 速度:32MHz 連通性:I²C，IrDA，SPI，UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位，DMA，POR，PWM，WDT 輸入/輸出數(shù):50 程序存儲器容量:192KB（96K x 16） 程序存儲器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 電壓 - 電源 (Vcc/Vdd):1.6 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 16x12b; D/A 2x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:64-TQFP 包裝:托盤 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM |
| MB9BF506NABGL-GE1 | 制造商:FUJITSU 功能描述:MCU 32BIT CORTEX-M3 FM3 112BGA 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 112BGA, Controller Family/Series:ARM Cortex-M3, Core |
| MB9BF506NAPMC-G-JNE1 | 制造商:FUJITSU 功能描述: 制造商:FUJITSU 功能描述:MCU 32BIT CORTEX-M3 FM3 100LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 100LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 100LQFP, Controller Family/Series:ARM Cortex-M3, Core Size:32bit, No. of I/O's:80, Supply Voltage Min:2.7V, Supply Voltage Max:5.5V, Digital IC Case Style:LQFP, No. of Pins:100, Program Memory Size:512KB, , RoHS Compliant: Yes |
| MB9BF506NBBGL-GE1 | 制造商:FUJITSU 功能描述: |
| MB9BF506NBPMC-G-JNE2 | 制造商:FUJITSU 功能描述: |
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