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參數(shù)資料
| 型號： | MAXQ610X-0001+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 26/29頁 |
| 文件大?。?/td> | 0K |
| 描述： | MAXQ610X PROG TESTED DIE WAFFLE |
| 產(chǎn)品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 1 |
| 系列： | MAXQ® |
| 核心處理器： | RISC |
| 芯體尺寸： | 16-位 |
| 速度： | 12MHz |
| 連通性： | SPI，UART/USART |
| 外圍設備： | 欠壓檢測/復位，紅外線，電源故障，POR，WDT |
| 輸入/輸出數(shù)： | 32 |
| 程序存儲器容量： | 64KB（64K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 2K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.7 V ~ 3.6 V |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 模具 |
| 包裝： | 托盤 |
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MAXQ610
16-Bit Microcontroller with Infrared Module
6
_______________________________________________________________________________________
RECOMMENDED DC OPERATING CONDITIONS (continued)
(VDD = VRST to 3.6V, TA = 0°C to +70°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
WAKE-UP TIMER
Wake-Up Timer Interval
tWAKEUP
1/fNANO
65,535/
fNANO
s
FLASH MEMORY
System Clock During Flash
Programming/Erase
fFPSYSCLK
6
MHz
tME
Mass erase
20
40
Flash Erase Time
tERASE
Page erase
20
40
ms
Flash Programming Time per
Word
tPROG
(Note 11)
20
100
μs
Write/Erase Cycles
20,000
Cycles
Data Retention
TA = +25°C
100
Years
IR
Carrier Frequency
fIR
(Note 5)
fCK/2
Hz
Note 1:
Specifications to 0°C are guaranteed by design and are not production tested.
Note 2:
It is not recommended to write to flash memory when the supply voltage drops below the power-fail warning levels as
there is uncertainty in the duration of continuous power supply. The user application should check the status of the power-
fail warning flag before writing to flash to ensure complete write operations.
Note 3:
The power-fail warning monitor and the power-fail reset monitor track each other with a minimum delta between the two of
0.11V.
Note 4:
The power-fail reset and power-on-reset (POR) detectors operate in tandem to ensure that one or both signals are active
at all times when VDD < VRST. Doing so ensures the device maintains the reset state until the minimum operating voltage is
achieved.
Note 5:
Guaranteed by design and not production tested.
Note 6:
Measured on the VDD pin and the part not in reset. All inputs are connected to GND or VDD. Outputs do not source/sink
any current. Part is executing code from flash memory.
Note 7:
The power-check interval (PCI) can be set to always on, 1024, 2048, or 4096 nanopower ring oscillator clock cycles.
Note 8:
Current consumption during POR when powering up while VDD < VPOR.
Note 9:
The minimum amount of time that VDD must be below VPFW before a power-fail event is detected.
Note 10: The maximum total current, IOH (max) and IOL (max), for all listed outputs combined should not exceed 32mA to satisfy
the maximum specified voltage drop. This does not include the IRTX output.
Note 11: Programming time does not include overhead associated with utility ROM interface.
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相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAXQ610X-0001+ | 功能描述:MAXQ610X PROG TESTED DIE WAFFLE RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MAXQ® 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:260 系列:73S12xx 核心處理器:80515 芯體尺寸:8-位 速度:24MHz 連通性:I²C，智能卡，UART/USART，USB 外圍設備:LED，POR，WDT 輸入/輸出數(shù):9 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:2K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-VFQFN 裸露焊盤 包裝:管件 |
| MAXQ610X-2001+ | 功能描述:16位微控制器 - MCU RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風格:SMD/SMT |
| MAXQ610X-2021+ | 制造商:Maxim Integrated Products 功能描述:16-BIT MICROCONTROLLER WITH INFRARED MODULE - Gel-pak, waffle pack, wafer, diced wafer on film |
| MAXQ610X-UEI+ | 制造商:Maxim Integrated Products 功能描述:MAXQ610 BLANK WLP UEI - Gel-pak, waffle pack, wafer, diced wafer on film |
| MAXQ612 | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:16-Bit Microcontrollers with Infrared Module and Optional USB |
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