參數(shù)資料
型號: MAX9993ETP-T
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: 衰減器
英文描述: High-Linearity 1700MHz to 2200MHz Down- Conversion Mixer with LO Buffer/Switch
中文描述: 1700 MHz - 2200 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 28 dB CONVERSION LOSS-MAX
封裝: 5 X 5 MM, 0.80 MM HEIGHT, MO-220, QFN-20
文件頁數(shù): 9/12頁
文件大?。?/td> 492K
代理商: MAX9993ETP-T
High-Linearity Mixer
The core of the MAX9993 is a double-balanced, high-
performance passive mixer. Exceptional linearity is pro-
vided by the large LO swing from the on-chip LO
buffer; IIP3 is typically +23.5dBm, IIP2 is typically
+60dBm, and total cascaded NF is 9.5dB.
Differential IF Output Amplifier
The MAX9993 mixer has an IF frequency range of 40MHz
to 350MHz. The differential, open-collector IF output ports
require external pullup inductors to V
CC
. Single-ended IF
applications require a 4:1 balun to transform the 200
differential output impedance to a 50
single-ended out-
put. After the balun, VSWR is typically 1.5:1.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50
.
No matching components are required. Return loss at
the RF port is better than 15dB over the entire input
range, 1700MHz to 2200MHz, and return loss at LO1
and LO2 is better than 10dB from 1400MHz to
2000MHz. RF and LO inputs require only DC-blocking
capacitors for interfacing. These DC-blocking capaci-
tors can be part of the matching circuit.
The IF output impedance is 200
differential out of the
IC. An external low-loss 4:1 balun brings this imped-
ance down to a 50
single-ended output (see the
Typical Application Circuit
).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier were
optimized by fine-tuning the resistors at LOBIAS and
IFBIAS during characterization at the factory. These cur-
rents should not be adjusted. If the 383
(±1%) and/or
523
(±1%) resistor values are not readily available,
substitute standard ±5% values: 390
and 520
,
respectively.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For best performance, route the ground pin
traces directly to the exposed pad underneath the
package. This pad should be connected to the ground
plane of the board by using multiple vias under the
device to provide the best RF/thermal conduction path.
Solder the exposed pad on the bottom of the device
package to a PC board exposed pad.
Power Supply Bypassing
Proper voltage supply bypassing is essential for high-
frequency circuit stability. Bypass each V
CC
pin and
TAP with the capacitors shown in the typical application
circuit. Place the TAP bypass capacitor to ground with-
in 100 mils of the TAP pin.
Chip Information
TRANSISTOR COUNT: 989
PROCESS: SiGe BiCMOS
M
High-Linearity 1700MHz to 2200MHz Down-
Conversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________
9
COMPONENT
C1
C2, C6, C7, C9, C10
C3, C5, C8
C4
C11, C12, C13
L1, L2
L3
R1
R2
R3, R4
R5
T1
VALUE
4pF
22pF
0.01μF
10pF
150pF
470nH
10nH
523
383
7.2
200
4:1 (200:50)
SIZE
0603
0603
0603
0603
0603
1008
0805
0603
0603
1206
0603
DESCRIPTION
Microwave capacitor
Microwave capacitors
Capacitors
Microwave capacitor
Microwave capacitors
Wire-wound high-Q inductors
Wire-wound high-Q inductor
±1% resistor
±1% resistor
±1% resistors
±5% resistor
IF balun
Table 1. Component List
相關PDF資料
PDF描述
MB200 RECTIFIERS
MB201 RECTIFIERS
MB202 RECTIFIERS
MB204 RECTIFIERS
MB206 RECTIFIERS
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