參數(shù)資料
型號(hào): MAX98089EWY+T
廠商: Maxim Integrated Products
文件頁數(shù): 32/131頁
文件大?。?/td> 0K
描述: IC CODEC AUDIO FLEXSOUND 63WLP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
系列: FlexSound™
類型: 立體聲音頻
數(shù)據(jù)接口: I²C,串行
分辨率(位): 24 b
ADC / DAC 數(shù)量: 2 / 2
動(dòng)態(tài)范圍,標(biāo)準(zhǔn) ADC / DAC (db): 93 / 101
電壓 - 電源,模擬: 1.65 V ~ 2 V
電壓 - 電源,數(shù)字: 1.65 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 63-WFBGA,WLCSP
供應(yīng)商設(shè)備封裝: 63-WLP
包裝: 帶卷 (TR)
Low-Power, Stereo Audio Codec
with FlexSound Technology
Route microphone signals from the microphone to the ICs
as a differential pair, ensuring that the positive and nega-
tive signals follow the same path as closely as possible
with equal trace length. When using single-ended micro-
phones or other single-ended audio sources, ground the
negative microphone input as close as possible to the
audio source and then treat the positive and negative
traces as differential pairs.
An evaluation kit (EV kit) is available to provide an exam-
ple layout for the IC. The EV kit allows quick setup of the
IC and includes easy-to-use software allowing all internal
registers to be controlled.
WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow temperature
profile, as well as the latest information on reliability test-
ing results, refer to the Application Note 1891: Wafer-
Level Packaging (WLP) and Its Applications. Figure 44
shows the dimensions of the WLP balls used on the
MAX98089EWY.
Figure 44. MAX98089EWY WLP Ball Dimensions
T = Tape and reel.
+Denotes lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Ordering Information
0.24mm
0.21mm
PART
TEMP RANGE
PIN-PACKAGE
MAX98089EWY+T
-40NC to +85NC
63 WLP
MAX98089ETN+T
-40NC to +85NC
56 TQFN-EP*
Maxim Integrated
127
MAX98089
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