參數(shù)資料
型號: MAX8896EREE+T
廠商: Maxim Integrated
文件頁數(shù): 2/17頁
文件大?。?/td> 449K
描述: IC REG TRPL BCK/LINEAR 16UCSP
產(chǎn)品培訓模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝: 1
拓撲: 降壓(降壓)同步(2),線性(LDO)(1)
功能: 任何功能
輸出數(shù): 3
頻率 - 開關: 2MHz
電壓/電流 - 輸出 1: 0.2 V ~ 1.7 V,700mA
電壓/電流 - 輸出 2: 3.1V,200mA
電壓/電流 - 輸出 3: 2.8V,200mA
帶 LED 驅(qū)動器:
帶監(jiān)控器:
帶序列發(fā)生器:
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-WFBGA,CSPBGA
供應商設備封裝: 16-UCSP(4x4)
包裝: 標準包裝
其它名稱: MAX8896EREE+TDKR
Dual PWM Step-Down Converter in a 2mm x
2mm Package for WCDMA PA and RF Power
2  _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS
(V
CC
= V
IN1
= V
IN2
= V
PAEN
= V
RFEN1
= V
RFEN2
= 3.6V, V
REFIN
= 0.72V, T
A
= -40癈 to +85癈, typical values are at T
A
= +25癈,
unless otherwise noted.) (Note 2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PARAMETER
CONDITIONS
MIN   TYP   MAX  UNITS
INPUT SUPPLY
Input Voltage
V
CC
, V
IN1,
 V
IN2
2.7
5.5    V
Input Undervoltage Threshold   V
CC
 rising, 180mV typical hysteresis
2.52   2.63
2.70    V
T
A
 = +25癈
0.1
4
Shutdown Supply Current
V
P AE N
 = V
R FE N 1
 =
 V
R FE N
2
 = 0
T
A
 = +85癈
0.1
LOGIC CONTROL
PAEN, RFEN1, RFEN2 Logic
Input High Voltage
2.7V d V
CC
 d 5.5V
1.3
V
PAEN, RFEN1, RFEN2 Logic
Input Low Voltage
2.7V d V
CC
 d 5.5V
0.4    V
PAEN, RFEN1, RFEN2 Internal
Pulldown Resistor
400   800   1600   k&
T
A
 = +25癈
0.01    1
PAEN, RFEN1, RFEN2 Logic
Input Current
V
IL
 = 0
T
A
 = +85癈
0.1
REFBP
REFBP Output Voltage
0礎 d IREFBP d 1礎
1.237  1.250  1.263   V
THERMAL PROTECTION
Thermal Shutdown
T
A
 rising, 20癈 typical hysteresis
+160
OUT1
Quiescent Supply Current
VRFEN1 = VRFEN2 = 0V, IPA = 0A,
no switching
155
p-channel MOSFET switch, I
LX1
 = -200mA
0.16   0.40
On-Resistance
n-channel MOSFET rectifier, I
LX1
 = 500mA
0.17   0.40
&
Load Regulation
R
L
 is the inductor resistance
R
L
/2
V/A
T
A
 = +25癈
0.1    5
LX1 Leakage Current
V
IN1
= 5.5V, V
LX1
 = 0V
T
A
 = +85癈
1
ABSOLUTE MAXIMUM RATINGS
V
CC
, IN1, IN2, PAEN, RFEN1, RFEN2,
REFIN, OUT2, REFBP to AGND.........................-0.3V to +6.0V
PAOUT to AGND........................................-0.3V to (V
IN1
+ 0.3V)
LDO to AGND.........................................-0.3V to (V
OUT2
+ 0.3V)
IN1, IN2 to V
CC
......................................................-0.3V to +0.3V
IN1 to IN2..............................................................-0.3V to +0.3V
PGND1, PGND2 to AGND.....................................-0.3V to +0.3V
LX1 Current.......................................................................1A
RMS
LX2 Current.......................................................................1A
RMS
IN1 and PAOUT Current....................................................1A
RMS
PAOUT, OUT2, LDO Short Circuit to PGND1,
PGND2....................................................................Continuous
Continuous Power Dissipation (T
A
= +70癈)
16-Bump UCSP (derate 12.5mW/癈 above +70癈)............1W
Junction-to-Ambient Thermal Resistance (?/DIV>
JA
) (Note 1)...96癈/W
Junction Temperature......................................................+150癈
Storage Temperature Range.............................-65癈 to +150癈
Bump Temperature (soldering, reflow) ...........................+260癈
Note 1:Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
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