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參數(shù)資料
| 型號： | MAX7359ETG+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 12/20頁 |
| 文件大小： | 0K |
| 描述： | IC KEY SWITCH 2WIRE 24-TQFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 應(yīng)用： | 移動電話，PDA，播放器 |
| 接口： | I²C |
| 電源電壓： | 1.65 V ~ 3.6 V |
| 封裝/外殼： | 24-WFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 24-TQFN-EP（3.5x3.5） |
| 包裝： | 帶卷 (TR) |
| 安裝類型： | 表面貼裝 |
MAX7359
2-Wire Interfaced Low-EMI
Key Switch Controller/GPO
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
VCC ..........................................................................-0.3V to +4V
COL2/PORT2–COL7/PORT7 ....................................-0.3V to +4V
SDA, SCL, AD0, INT .................................................-0.3V to +6V
All Other Pins ..............................................-0.3V to (VCC + 0.3V)
DC Current on COL2/PORT2–COL7/PORT7 ......................25mA
GND Current .......................................................................80mA
Continuous Power Dissipation (TA = +70°C)
24-Pin TQFN (derate 15.4mW/°C above +70°C) ........1229mW
25-Bump WLP (derate 19.2mW/°C above +70°C)......1194mW
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
24-Pin TQFN.................................................................5.4°C/W
25-Bump WLP ...............................................................17°C/W
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
24-Pin TQFN...............................................................65.1°C/W
25-Bump WLP ...............................................................53°C/W
Operating Temperature Range (TMIN to TMAX) .....-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (TQFN only, soldering, 10s) ..............+300°C
Soldering Temperature (reflow) .......................................+260°C
ELECTRICAL CHARACTERISTICS
(VCC = +1.62V to +3.6V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +2.5V, TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Supply Voltage
VCC
1.62
3.60
V
All key switches open, oscillator running,
COL2–COL7 configured as key switches
25
60
Operating Supply Current
ICC
N keys pressed
(25 +
20 x N)
A
Sleep-Mode Supply Current
ISL
0.6
5
A
POR
1.0
1.6
V
POR Hysteresis
PORHYST
VCC rising
42
mV
Key-Switch Source Current
IKEY
20
35
A
Key-Switch Source Voltage
VKEY
Operating mode
0.42
0.55
V
Key-Switch Resistance
RKEY
(Note 4)
5
k
Startup Time from Shutdown
tSTART
2
2.4
ms
Output Low Voltage
COL2/PORT2 to COL7/PORT7
VOLPORT
ISINK = 10mA
0.2
V
INT Output
VOLINT
ISINK = 10mA
0.5
V
Oscillator Frequency
FOSC
64
kHz
SERIAL-INTERFACE SPECIFICATIONS
Serial Bus Timeout
tOUT
With bus timeout enabled
10
40
ms
Input High Voltage
SDA, SCL, AD0
VIH
0.7 x
VCC
V
Input Low Voltage
SDA, SCL, AD0
VIL
0.3 x
VCC
V
Output Low Voltage SDA
VOLPORT
ISINK = 10mA
0.4
V
Input Leakage Current
VCC = 0V to +6V
-1
+1
A
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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