參數(shù)資料
型號(hào): MAX6900ETT
廠商: Maxim Integrated Products, Inc.
英文描述: Hex Bus Drivers With 3-State Outputs 16-CFP -55 to 125
中文描述: 塑封器件
文件頁(yè)數(shù): 3/8頁(yè)
文件大?。?/td> 47K
代理商: MAX6900ETT
II. Manufacturing Information
A. Description/Function:
I
2
C-Bus-Compatible Real-Time Clock
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I.
Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
B. Process:
TC05
C. Number of Device Transistors:
19,307
D. Fabrication Location:
Taiwan
E. Assembly Location:
Malaysia
F. Date of Initial Production:
January, 2001
6-Lead QFN (3x3)
Copper
Solder Plate
Silver-Filled Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
Buildsheet # 05-9000-0530
Class UL94-V0
70 x 44 mils
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
Al/Si/Cu (Aluminum/ Silicon/ Copper)
None
Metal 1: 0.9 microns; Metal 2: 0.9 microns (as drawn)
Metal 1: 0.8 microns; Metal 2: 0.8 microns (as drawn)
5 mil. Sq.
SiO
2
Wafer Saw
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MAX6900ETTAEQ 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
MAX6900ETTAEQ-T 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
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