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參數(shù)資料
| 型號： | MAX5926EEE+ |
| 廠商： | Maxim Integrated |
| 文件頁數(shù)： | 19/21頁 |
| 文件大小： | 333K |
| 描述： | IC HOT-SWAP CONTROLLER 16QSOP-EP |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 100 |
| 類型： | 熱交換控制器 |
| 應(yīng)用： | 通用 |
| 內(nèi)部開關(guān)： | 無 |
| 電源電壓： | 1 V ~ 13.2 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-LSSOP（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-QSOP 裸露焊盤 |
| 包裝： | 管件 |
Layout Considerations
Keep all traces as short as possible and maximize the
high-current trace dimensions to reduce the effect of
undesirable parasitic inductance. Place the MAX5924/
MAX5925/MAX5926 close to the cards connector. Use
a ground plane to minimize impedance and induc-
tance. Minimize the current-sense resistor trace length
(<10mm), and ensure accurate current sensing with
Kelvin connections.
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence, the
power dissipation across the switch increases, as does
the die temperature. An efficient way to achieve good
power dissipation on a surface-mount package is to lay
out two copper pads directly under the MOSFET pack-
age on both sides of the board. Connect the two pads
to the ground plane through vias, and use enlarged
copper mounting pads on the top side of the board.
It is important to maximize the thermal coupling between
the MOSFET and the MAX5925/MAX5926 to balance the
device junction temperatures. When the temperatures of
the two devices are equal, the circuit-breaker trip
threshold is most accurate. Keep the MOSFET and the
MAX5925/MAX5926 as close to each other as possible
to facilitate thermal coupling.
1V to 13.2V, n-Channel Hot-Swap Controllers
Require No Sense Resistor
______________________________________________________________________________________ 19
SENSE RESISTOR
HIGH-CURRENT PATH
MAX5924
MAX5925
MAX5926
R
CB
Figure 15. Kelvin Connection for the Current-Sense Resistor
Selector Guide
POWER-GOOD OUTPUT
PART
CIRCUIT-BREAKER
TEMPCO
(ppm/癈)
FAULT MANAGEMENT
PGOOD
PGOOD
(OPEN-DRAIN)
MAX5924A
0
Latched
MAX5924B
0
Latched
MAX5924C
0
Autoretry
MAX5924D
0
Autoretry
MAX5925A
3300
Latched
MAX5925B
3300
Latched
MAX5925C
3300
Autoretry
MAX5925D
3300
Autoretry
MAX5926
0 or 3300 (Selectable)
Latched or Autoretry (Selectable)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MAX5929BEEG+ | IC HOT SWAP CTLR QUAD 24QSOP |
| MAX5930AEEG+ | IC HOT SWAP CTLR PWR SEQ 24QSOP |
| MAX5932ESA+T | IC HOT-SWAP CONTROLLER 8-SOIC |
| MAX5933EESA+ | IC HOT-SWAP CONTROLLER 8-SOIC |
| MAX5934EEE+ | IC HOT-SWAP CONTROLLER 16-QSOP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX5926EEE+ | 功能描述:熱插拔功率分布 1-13.2V Hot-Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5926EEE+T | 功能描述:熱插拔功率分布 1-13.2V Hot-Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5926EEE-T | 功能描述:熱插拔功率分布 RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| MAX5926EVKIT | 制造商:Maxim Integrated Products 功能描述:1V TO 13.2V N-CHANNEL HOT-SWAP CON - Rail/Tube |
| MAX5927AETJ+ | 功能描述:熱插拔功率分布 Quad Hot-Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
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