參數(shù)資料
型號： MAX5895EGK
廠商： MAXIM INTEGRATED PRODUCTS INC
元件分類： DAC
英文描述： 16-Bit, 500Msps Interpolating and Modulating Dual DAC with CMOS Inputs
中文描述： PARALLEL, WORD INPUT LOADING, 0.011 us SETTLING TIME, 16-BIT DAC, QCC68
封裝： 10 X 10 MM, MO-220, QFN-68
文件頁數(shù)： 2/32頁
文件大小： 807K
代理商： MAX5895EGK
M
16-Bit, 500Msps Interpolating and Modulating
Dual DAC with CMOS Inputs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DV
DD1.8
, AV
DD1.8
to GND, DACREF ..................-0.3V to +2.16V
AV
DD3.3
, AV
CLK
, DV
DD3.3
to GND, DACREF........-0.3V to +3.9V
DATACLK, A0–A15, B0–B13,
SELIQ/B15, DATACLK/B14,
CS
,
RESET
, SCLK,
SDI and SDO to GND, DACREF......-0.3V to (DV
DD3.3
+ 0.3V)
CLKP, CLKN to GND, DACREF..............-0.3V to (AV
CLK
+ 0.3V)
REFIO, FSADJ to GND, DACREF ........-0.3V to (AV
DD3.3
+ 0.3V)
OUTIP, OUTIN, OUTQP,
OUTQN to GND, DACREF..................-1V to (AV
DD3.3
+ 0.3V)
ELECTRICAL CHARACTERISTICS
(DV
DD1.8
= AV
DD1.8
= 1.8V, AV
CLK
= AV
DD3.3
= DV
DD3.3
= 3.3V, modulator off, 2x interpolation, DATACLK input mode, dual-port
mode, 50
double-terminated outputs, external reference at 1.25V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are
at T
A
= +25°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
SDO, DATACLK, DATACLK/B14 Continuous Current..........8mA
Continuous Power Dissipation (T
A
= +70°C)
68-Pin QFN (derate 41.7mW/°C above +70°C)
(Note 1) ...................................................................3333.3mW
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Thermal Resistance
θ
JC
(Note 1)...................................-0.8°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
Differential Nonlinearity
Integral Nonlinearity
Offset Error
Offset Drift
Full-Scale Gain Error
Gain-Error Drift
Full-Scale Output Current
Output Compliance
Output Resistance
Output Capacitance
DYNAMIC PERFORMANCE
Maximum Clock Frequency
Minimum Clock Frequency
Maximum DAC Update Rate
Minimum DAC Update Rate
Maximum Input Data Rate
16
±1
±3
Bits
LSB
LSB
%FS
ppm/°C
%FS
ppm/°C
mA
V
M
pF
DNL
INL
OS
-0.01
±0.003
±0.03
±0.6
±110
+0.01
GE
FS
-4
+4
I
OUTFS
2
20
+1.1
-0.5
R
OUT
C
OUT
1
5
f
CLK
f
CLK
f
DAC
f
DAC
f
DATA
500
MHz
MHz
Msps
Msps
MWps
1
f
DAC
= f
CLK
or f
DAC
= f
CLK
/ 2
f
DAC
= f
CLK
or f
DAC
= f
CLK
/ 2
500
1
125
No interpolation
2x interpolation
4x interpolation
-157
-158
-157
f
DATACLK
= 125MHz,
f
OUT
= 16MHz, f
OFFSET
= 10MHz, -12dBFS
Noise Spectral Density
f
DATACLK
= 125MHz,
f
OUT
= 16MHz, f
OFFSET
= 10MHz, 0dBFS
4x interpolation
-149
dBFS/
Hz
Note 1:
Thermal resistance based on a multilayer board with 4 x 4 via array in exposed paddle area.
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參數(shù)描述
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