參數(shù)資料
型號: MAX5548ETE
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: DAC
英文描述: Dual, 8-Bit, Programmable, 30mA High-Output-Current DAC
中文描述: SERIAL INPUT LOADING, 30 us SETTLING TIME, 8-BIT DAC, QCC16
封裝: 3 X 3 MM, 0.80 MM HEIGHT, EXPOSED PAD, MO-220WEED-2, QFN-16
文件頁數(shù): 8/15頁
文件大?。?/td> 296K
代理商: MAX5548ETE
M
Detailed Description
Architecture
The MAX5548 8-bit, dual current-steering DAC (see the
Functional Diagram
) operates with DAC update rates
up to 10Msps in SPI mode and 400ksps in I
2
C mode.
The converter consists of a 16-bit shift register and
input DAC registers, followed by a current-steering
array. The current-steering array generates full-scale
currents up to 30mA per DAC. An integrated +1.25V
bandgap reference, control amplifier, and an external
resistor determine each data converter’s full-scale
output range.
Reference Architecture and Operation
The MAX5548 provides an internal +1.25V bandgap ref-
erence or accepts an external reference voltage source
between +0.5V and +1.5V. REFIN serves as the input for
an external low-impedance reference source. Leave
REFIN unconnected in internal reference mode. Internal
or external reference mode is software selectable
through the SPI/I
2
C serial interface.
The MAX5548’s reference circuit (
Figure 1) employs a
control amplifier to regulate the full-scale current (I
FS
)
for the current outputs of the DAC. This device has a
software-selectable full-scale current range (see the
command summary in Table 4). After selecting a cur-
rent range, an external resistor (R
FSADJ
_) sets the full-
scale current. See Table 1 for a matrix of I
FS
and
R
FSADJ
selections.
During startup, when the power is first applied, the
MAX5548 defaults to the external reference mode, and
to the 1mA–2mA full-scale current-range mode.
DAC Data
The 8-bit DAC data is decoded as offset binary, MSB
first, with 1 LSB = I
FS
/ 256, and converted into the cor-
responding current as shown in Table 2.
Serial Interface
The MAX5548 features a pin-selectable SPI/I
2
C serial
interface. Connect SPI/
I2C
to GND to select I
2
C mode,
or connect SPI/
I2C
to V
DD
to select SPI mode. SDA
and SCL (I
2
C mode) and DIN, SCLK, and
CS
(SPI
Dual, 8-Bit, Programmable, 30mA
High-Output-Current DAC
8
_______________________________________________________________________________________
Pin Description
PIN
1
2
NAME
SCLK/SCL
DIN/SDA
FUNCTION
Serial Clock Input. Connect SCL to V
DD
through a 2.4k
resistor in I
2
C mode.
Serial Data Input. Connect SDA to V
DD
through a 2.4k
resistor in I
2
C mode.
Chip-Select Input in SPI Mode/Address Select 0 in I
2
C Mode.
CS
is an active-low input. Connect A0 to
V
DD
or GND to set the device address in I
2
C mode.
3
CS
/A0
4
SPI/
I2C
SPI/
I2C
Select Input. Connect SPI/
I2C
to V
DD
to select SPI mode, or connect SPI/
I2C
to GND to select
I
2
C mode.
5
DOUT/A1
Serial Data Output in SPI Mode/Address Select 1 in I
2
C Mode. Use DOUT to daisy chain the MAX5548 to
other devices or to read back in SPI mode. The digital data is clocked out on SCLK’s falling edge.
Connect A1 to V
DD
or GND to set the device address in I
2
C mode.
6, 13, 15
N.C.
No Connection. Leave unconnected or connect to GND.
7
REFIN
Reference Input. Drive REFIN with an external reference source between +0.5V and +1.5V. Leave REFIN
unconnected in internal reference mode. Bypass REFIN with a 0.1μF capacitor to GND as close to the
device as possible.
8, 16
9
GND
OUTB
Ground
DACB Output. OUTB provides up to 30mA of output current.
10
FSADJB
D AC B Ful S cal e Ad ust Inp ut. For m axi m um ful scal e outp ut cur ent, connect a 20k
r esi stor b etw een
FS AD JB and G N D For m ni m um ful scal e cur ent, connect a 40k
r esi stor b etw een FS AD JB and G N D
11
FSADJA
D AC A Ful S cal e Ad ust Inp ut. For m axi m um ful scal e outp ut cur ent, connect a 20k
r esi stor b etw een
FS AD JA and G N D For m ni m um ful scal e cur ent, connect a 40k
r esi stor b etw een FS AD JA and G N D
DACA Output. OUTA provides up to 30mA of output current.
12
OUTA
14
V
DD
Power-Supply Input. Connect V
DD
to a +2.7 to +5.25V power supply. Bypass V
DD
to GND with a 0.1μF
capacitor as close to the device as possible.
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