參數(shù)資料
型號: MAX5038A
廠商: Maxim Integrated Products, Inc.
英文描述: Dual-Phase. Parallelable. Average-Current-Mode Controllers
中文描述: 雙相、可并聯(lián)、平均電流模式控制器
文件頁數(shù): 25/26頁
文件大?。?/td> 680K
代理商: MAX5038A
M
Dual-Phase, Parallelable, Average-Current-Mode
Controllers
______________________________________________________________________________________
25
C
CF
provides a low-frequency pole while R
CF
provides a
midband zero. Place a zero (f
Z
) to obtain a phase bump
at the crossover frequency. Place a high-frequency pole
(f
P
) at least a decade away from the crossover frequency
to reduce the influence of the switching noise and
achieve maximum phase margin. Use the following
equations to calculate C
CF
and C
CFF
:
PC Board Layout
Use the following guidelines to lay out the switching
voltage regulator:
1) Place the V
IN
and V
CC
bypass capacitors close to
the MAX5038A/MAX5041A.
2) Minimize the area and length of the high-current
loops from the input capacitor, upper switching
MOSFET, inductor, and output capacitor back to
the input capacitor negative terminal.
3) Keep short the current loop formed by the lower
switching MOSFET, inductor, and output capacitor.
4) Place the Schottky diodes close to the lower
MOSFETs and on the same side of the PC board.
5) Keep the SGND and PGND isolated and connect
them at one single point close to the negative termi-
nal of the input filter capacitor.
6) Run the current-sense lines CS+ and CS- very
close to each other to minimize the loop area.
Similarly, run the remote voltage sense lines
SENSE+ and SENSE- close to each other. Do not
cross these critical signal lines through power cir-
cuitry. Sense the current right at the pads of the
current-sense resistors.
7) Avoid long traces between the V
CC
bypass capaci-
tors, driver output of the MAX5038A/MAX5041A,
MOSFET gates, and PGND. Minimize the loop
formed by the V
CC
bypass capacitors, bootstrap
diode, bootstrap capacitor, MAX5038A/MAX5041A,
and upper MOSFET gate.
8) Place the bank of output capacitors close to the load.
9) Distribute the power components evenly across the
board for proper heat dissipation.
10) Provide enough copper area at and around the
switching MOSFETs, inductor, and sense resistors
to aid in thermal dissipation.
11) Use 4oz copper to keep the trace inductance and
resistance to a minimum. Thin copper PC boards
can compromise efficiency since high currents are
involved in the application. Also, thicker copper
conducts heat more effectively, thereby reducing
thermal impedance.
Chip Information
TRANSISTOR COUNT: 5431
PROCESS: BiCMOS
C
f
R
CFF
P
CF
=
×
×
×
1
2
π
C
f
R
CF
Z
CF
=
×
×
×
1
2
π
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CLKIN
CLKOUT
BST2
DH2
LX2
DL2
EN
PGND
IN
V
CC
DL1
LX1
DH1
BST1
CSN1
CSP1
EAOUT
EAN
DIFF
SENSE-
SENSE+
CLP1
SGND
CLP2
PLLCMP
PHASE
CSN2
CSP2
SSOP
TOP VIEW
MAX5038A
MAX5041A
Pin Configuration
(31)
(32)
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