參數(shù)資料
型號: MAX3969D
廠商: Maxim Integrated Products, Inc.
英文描述: 2x2 Crosspoint Switch : LVDS Outputs 16-SOIC -40 to 85
中文描述: 200Mbps的SFP限幅放大器
文件頁數(shù): 8/11頁
文件大?。?/td> 724K
代理商: MAX3969D
M
Applications Information
Wire Bonding
For high-current density and reliable operation, the
MAX3969 uses gold metalization. For best results, use
gold-wire ball-bonding techniques. Use caution if
attempting wedge bonding. Die pad size is 4 mils x 4
mils. Die thickness is 16 mils.
Table 1 lists the bond pad coordinates for the MAX3969.
The origin for pad coordinates is defined as the bottom
left corner of the bottom left pad. All pad locations are
referenced from the origin and indicate the center of the
pad where the bond wire should be connected. Refer to
Maxim Application Note HFAN-08.0.1:
Understanding
Bonding-Coordinates and Physical Die Size
for detailed
information.
200Mbps SFP Limiting Amplifier
8
_______________________________________________________________________________________
COORDINATES (
μ
m)
X
46.6
46.6
46.6
46.6
46.6
195.1
432.7
589.3
743.2
945.7
1204.9
1204.9
1204.9
1204.9
1204.9
1053.7
808.0
586.6
432.7
195.1
PAD
NAME
Y
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
INV
FILTER
RSSI
IN-
IN+
GND
GND
GND
CZP
CZN
V
CCO
OUT+
OUT-
SD
LOS
LOS
V
CC
V
CC
SQUELCH
V
TH
659.5
505.6
351.7
197.8
46.6
-99.1
-99.1
-99.1
-99.1
-99.1
-96.4
81.7
262.6
492.1
697.3
818.8
818.8
818.8
818.8
818.8
Table 1. Bond Pad Coordinates
20
19
18
17
V
T
S
V
C
V
C
16
L
13
12
11
14
15
OUT+
OUT-
SD
LOS
V
CCO
4
3
2
1
IN-
RSSI
FILTER
INV
5
IN+
6
7
8
9
G
G
THIN QFN
G
C
10
C
MAX3969
TOP VIEW
Pin Configuration
Chip Information
TRANSISTOR COUNT: 915
SUBSTRATE CONNECTED TO GND
PROCESS: Silicon Bipolar
DIE THICKNESS: 16 mils
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